Narrow-Top Semiconductor Terminal Insulation for Fine-Pitch Bonding
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Solution Overview
Problem
The reduction in pitch between external connection terminals in semiconductor devices leads to increased alignment deviations between the wiring board and the element substrate, causing junction failures.
Innovation Solution
The semiconductor device incorporates an insulating portion with a top width smaller than the diameter of the conductive particle, featuring inclined lateral sides, which allows for stable electrical connection even with alignment deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the pitch between external connection terminals is decreased to reduce device size, then the device size is reduced, but alignment deviation between wiring board and element substrate increases causing junction failures
Solution Approach 1:
The insulating portion serves as an intermediary guide structure between the terminal and the wiring board. It provides a physical guide that directs the conductive particle to the terminal even when alignment deviation occurs, thereby maintaining junction reliability while allowing smaller pitch between terminals
Solution Approach 2:
The insulating portion is pre-formed with specific dimensional characteristics (top width smaller than conductive particle diameter, inclined lateral sides) before the wiring board is attached. This preliminary structure guides the conductive particle into proper alignment during compression bonding, preventing junction failures without requiring wider terminal pitch
2Reliability
If the external connection terminals are designed to be wider to provide alignment margin, then alignment reliability is improved, but the pitch between external connection terminals cannot be decreased
Solution Approach 1:
The insulating portion acts as a guide member that compensates for alignment deviations. It allows the terminals to maintain smaller width while still achieving reliable electrical connection, as the insulating portion guides the conductive particle to the terminal even when the wiring board is slightly misaligned
Solution Approach 2:
The insulating portion is designed with specific dimensional parameters: top width smaller than the conductive particle diameter, and lateral sides that are inclined rather than vertical. These parameter changes enable the insulating portion to guide the conductive particle effectively while allowing terminal pitch to be reduced
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces conductive failures and enables a smaller terminal pitch, facilitating a reduction in semiconductor device size without compromising electrical connectivity.
Implementation Method 1
it is necessary to design the external connection terminals to be relatively wide in consideration of an alignment margin. As a result, it is difficult to decrease the pitch between the external connection terminals
Data Source
AI summary
A semiconductor device comprises a first substrate; a functional element arranged on a main surface of the first substrate; a terminal connected to an electrode electrically connected to the functional element and arranged on a second substrate different from the first substrate; an insulating portion configured to cover an end of the terminal; and a conductive film arranged on the terminal and the insulating portion and containing a conductive particle, wherein in a section perpendicular to the main surface of the first substrate, the insulating portion includes a top and lateral sides inclined with respect to the top, and a width of the top is smaller than a diameter of the conductive particle.