Double-Sided Electronic Assembly With Stiffening for Warpage Control
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Solution Overview
Problem
Electronic assemblies face warpage issues due to the weight and pressure of densely packed components on substrate panels, leading to mounting and assembly challenges, circuit breaks, and impaired electrical performance.
Innovation Solution
Incorporation of a stiffening member within the electronic assembly to provide structural support and minimize warpage, allowing for high-density, double-sided packaging of components on a substrate with semiconductor dies and power supply modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large number of components are densely packed on the substrate panel, then the area utilization is improved, but the substrate panel experiences warpage due to weight and pressure
Solution Approach 1:
A stiffening member is introduced as an intermediary element between the substrate panel and the components. This stiffening member distributes the weight and pressure of densely packed components across a larger area of the substrate panel, preventing localized stress concentration that causes warpage. The stiffening member acts as a mediator that enables high area utilization while maintaining substrate panel stability.
2Ease of manufacture
If relatively large empty areas are left between components or a larger substrate panel is used, then component mounting is easier, but the substrate panel experiences warping
Solution Approach 1:
The stiffening member serves multiple functions simultaneously: it provides mechanical support to prevent warpage, acts as a mounting structure for components, and distributes loads across the substrate panel. This multi-functional element enables the substrate panel to maintain stability whether components are densely packed or spaced apart, and whether the panel size is large or small.
3Ease of manufacture
If warpage is prevented by using a larger substrate panel, then component assembly is easier, but the area occupied by the electronic assembly increases
Solution Approach 1:
The stiffening member is divided into multiple segments or sections that can be strategically positioned on the substrate panel. These segmented stiffening members provide distributed support to prevent warpage in specific high-stress areas where components are mounted, rather than requiring a uniformly large substrate panel. This segmentation allows the electronic assembly to maintain a compact footprint while still preventing warpage through targeted reinforcement.
Data Source
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AI summary
An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die.