3D System-in-Package Layout for Thermal and Power Delivery
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Solution Overview
Problem
Computing devices face challenges in reducing PCB size due to mechanical and thermal limitations, as well as fabrication and assembly considerations, particularly with memory and power delivery components.
Innovation Solution
An integrated system-in-package (SIP) design that includes a first and second component with opposing thermal regulation surfaces, allowing for thermal management, and uses through-mold vias (TMVs) and passive components encapsulated in magnetic or high dielectric media to reduce footprint and improve power delivery efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If components are rearranged to reduce PCB size, then PCB area is reduced, but mechanical and thermal limitations as well as fabrication and assembly considerations restrict such rearrangement
Solution Approach 1:
The patent transitions from planar component arrangement on PCB to three-dimensional vertical stacking in package. Multiple components (processor, memory, power delivery) are arranged in vertical layers within a single package substrate, utilizing the Z-dimension to reduce the two-dimensional PCB footprint while maintaining manufacturability through established package assembly processes
2Area of stationary object
If components are rearranged to reduce PCB size, then PCB area is reduced, but thermal management becomes more difficult
Solution Approach 1:
The patent implements vertical thermal pathways through the package structure, with thermal vias and heat dissipation surfaces extending through multiple layers. The package substrate incorporates thermal management features in the vertical dimension, allowing heat from densely packed components to be conducted away through dedicated thermal paths rather than requiring lateral thermal management on a large PCB
Solution Approach 2:
The package substrate acts as an intermediary thermal management component between the active components (processor, memory) and the external environment. It provides integrated thermal vias, heat spreaders, and thermal interface surfaces that mediate heat transfer from multiple heat-generating components to external heat sinks, simplifying thermal management compared to direct PCB mounting
3Area of stationary object
If components are rearranged to reduce PCB size, then PCB area is reduced, but mechanical limitations restrict such rearrangement
Solution Approach 1:
The patent distributes mechanical stresses vertically through the package structure rather than concentrating them on the PCB plane. The package substrate provides a rigid three-dimensional framework that supports multiple components in vertical stacking, transferring mechanical loads through the Z-dimension and reducing the mechanical burden on the PCB while achieving compact footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SIP design achieves a compact footprint and enhanced thermal and power delivery performance by vertically integrating components and using TMVs to minimize losses and noise, optimizing space utilization.
Implementation Method 1
a first thermal regulation surface of the first component is opposite a second thermal regulation surface of the second component
Implementation Method 2
The passive component comprises the TMV encapsulated in a magnetic medium or a high dielectric medium
Implementation Method 3
The passive component comprises the TMV encapsulated in a magnetic medium or a high dielectric medium
Data Source
AI summary
The disclosed device package includes a processing unit having a first thermal regulation surface and a power delivery unit having a second thermal regulation surface. The power delivery unit is mounted on the processing unit such that the second thermal regulation surface is opposite the first thermal regulation surface. Various other methods, systems, and computer-readable media are also disclosed.