PCB Planar Transformer Winding Structure for Simpler Compact Manufacturing
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Solution Overview
Problem
Traditional planar transformers face complications in process and high costs due to multi-layer stacked windings, with traditional wound transformers being large, costly, and prone to inconsistencies and failures.
Innovation Solution
A PCB with a double-sided winding part molded by colloid injection, featuring a symmetric structure with integrated via holes and wire blocking parts, allowing simultaneous double-sided winding using automatic equipment, reducing the need for self-adhesive coatings and minimizing human error.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multi-layer stacked windings are used in planar transformers, then the transformer can achieve compact structure and small size, but the PCB process becomes complicated and cost increases
Solution Approach 1:
The patent divides the winding structure into separate single-layer windings on each side of the PCB, avoiding complex multi-layer stacking. Each side independently forms a winding layer, simplifying the PCB manufacturing process while maintaining compact transformer dimensions.
Solution Approach 2:
The patent transitions from planar multi-layer stacking to three-dimensional vertical winding through the PCB thickness. The magnetic core passes through the PCB, allowing windings to be formed around it in a vertical dimension, achieving compact size without complex multi-layer PCB processes.
2Ease of manufacture
If traditional wound transformers are used, then the structure is simple and easy to manufacture, but the product volume is large and cost reduction capability is low
Solution Approach 1:
The patent merges the PCB substrate with the transformer winding structure. The PCB serves both as the circuit board and as the form for the windings, eliminating the need for separate bobbins and reducing overall product volume while maintaining manufacturing simplicity.
Solution Approach 2:
The patent uses the vertical dimension through the PCB thickness for winding, rather than expanding horizontally. The magnetic core passes through the PCB, and windings are formed around it, achieving compact volume while keeping the manufacturing process simple and straightforward.
3Adaptability or versatility
If manual coating of self-adhesive layers is performed, then the winding process can be flexible, but the manufacturing time increases and human error affects product consistency
Solution Approach 1:
The patent uses self-adhesive copper foil that adheres to the PCB substrate without requiring manual coating of separate adhesive layers. The foil's inherent adhesive properties enable direct winding, eliminating time-consuming coating steps while maintaining process flexibility and improving product consistency.
Solution Approach 2:
The patent replaces the mechanical process of manual adhesive coating with the material property of self-adhesive copper foil. The adhesive function is built into the material itself, eliminating the need for separate coating operations and reducing manufacturing time while ensuring consistent adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, reliable, and cost-effective planar transformer with improved consistency and reduced manufacturing time, eliminating the need for polyimide films and self-adhesive layers, while ensuring high product pass rates and stability.
Implementation Method 1
a double-sided winding part formed on double sides of the PCB substrate by colloid injection molding and integrated with the PCB substrate
Implementation Method 2
The metal conducting wire is coated with a self-adhesive layer; and during winding on the double-sided winding part, fixing while winding is achieved by heating
Data Source
AI summary
Disclosed is a PCB of a planar transformer including: a PCB substrate with a through hole and a double-sided winding part formed on double sides of the PCB substrate, wherein the double-sided winding part is of a symmetric structure, a via hole consistent with the through hole is formed in the center of the double-sided winding part, the via hole is aligned to the through hole to form a magnetic core hole, and the circumference of the via hole is raised to form wire blocking parts; and forming a wire passing groove in the wall of the magnetic core hole, wherein the wire passing groove allows a metal conducting wire to pass through to be planarly wound from inside to outside on double sides of the double-sided winding part at the same time so as to form two coils in series located on the double sides of the PCB substrate.