Solder Ball Attachment Layout for Warped Substrate Strips
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Solution Overview
Problem
Existing ball attachment apparatuses struggle with maintaining alignment of solder balls and ball pads on substrate strips due to thermal stress-induced deformation during manufacturing processes like chip mounting and molding.
Innovation Solution
The apparatus includes a tool case with holding tools spaced apart at varying intervals to accommodate substrate strip deformation, and insertion blocks with different widths to maintain precise alignment of solder balls with ball pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uniform spacing is used between holding tools, then the device structure is simple, but alignment precision deteriorates due to substrate deformation
Solution Approach 1:
The holding tools are arranged with non-uniform spacing where the spacing between adjacent holding tools increases with distance from the center of the substrate. Specifically, the first spacing (near center) is smaller than the second spacing (farther from center), accommodating the thermal deformation pattern where edges expand more than the center, thereby maintaining alignment precision across the entire substrate surface.
2Productivity
If multiple attachment processes are used to cover deformed substrates, then alignment precision is maintained, but productivity decreases
Solution Approach 1:
The substrate surface is divided into multiple regions, each served by a holding tool with specific spacing from its neighbors. This segmentation allows the entire deformed substrate to be covered in a single attachment process, as each holding tool is positioned to account for local deformation characteristics, thereby maintaining precision while maximizing productivity.
Solution Approach 2:
The holding tools are pre-positioned with non-uniform spacing before the attachment process begins, anticipating the thermal deformation that will occur. This preliminary configuration of spacing allows the system to accommodate substrate deformation without requiring multiple attachment passes, thus maintaining both precision and high productivity.
3Adaptability or versatility
If holding tools are closely spaced, then coverage is complete, but the device cannot accommodate thermal expansion variations
Solution Approach 1:
The spacing between holding tools is intentionally made asymmetric relative to the substrate center, with larger spacing allocated to regions farther from the center where thermal expansion is greater. This asymmetric spacing configuration allows the tool case to accommodate thermal deformation variations across different regions of the substrate without requiring excessive overall area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the alignment of solder balls and ball pads, enhancing productivity by allowing a single solder ball attachment process to cover the entire deformed substrate strip.
Implementation Method 1
a plurality of holding tools in the tool case spaced apart from each other in a first direction, each of the plurality of holding tools including a plurality of holding regions and each of the plurality of holding regions including adsorption holes
Data Source
AI summary
A ball attachment apparatus includes a tool case having a bottom surface on which solder balls are adsorbed for attachment to a substrate strip including a plurality of substrate units, a plurality of holding tools in the tool case spaced apart from each other in a first direction, including a plurality of holding regions disposed in the tool case each including adsorption holes, the holding regions respectively corresponding to the substrate units and the adsorption holes respectively corresponding to ball pads of the substrate units, and a plurality of insertion blocks respectively disposed between adjacent ones of the holding tools, wherein, among gaps between the holding tools, a first gap at a first distance from a center of the tool case is different from at least one second gap at a second distance greater than the first distance from the center of the tool case.