Component Carrier Cavity Formation Using Trimmed Release Layers
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Solution Overview
Problem
Conventional methods for forming cavities in component carriers lack the necessary accuracy, particularly in the context of miniaturization, leading to issues such as excessive undercuts and reduced mechanical and electrical reliability.
Innovation Solution
A method involving the formation of a poorly adhesive structure on a layer stack, followed by precise trimming using laser processing to define the cavity limits, and subsequent removal of material to create a cavity with minimal or no undercut, using laser trimming to enhance spatial accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to form cavities in laminated layer stacks, then the manufacturing process is simple, but the spatial accuracy and precision of the cavity are insufficient
Solution Approach 1:
A poorly adhesive structure is formed on the layer stack before cavity formation. This preliminary structure serves as a precise template that defines the cavity boundaries. The structure is trimmed to exact dimensions before subsequent material removal, ensuring high spatial accuracy in the final cavity without requiring complex direct machining methods
Solution Approach 2:
The poorly adhesive structure acts as an intermediary element between the manufacturing process and the final cavity. It provides a precisely defined boundary that guides the material removal process, mediating between the simple lamination process and the high-precision cavity requirement. This intermediary structure enables accurate cavity formation through simpler subsequent steps
2Manufacturing precision
If conventional cavity formation methods are used, then the process is straightforward, but lateral undercut exceeds acceptable limits
Solution Approach 1:
The poorly adhesive structure is trimmed to precise dimensions before the material removal step. This preliminary trimming establishes exact lateral boundaries that prevent undercut during subsequent cavity formation. The structure serves as a physical constraint that guides the etching or removal process to stay within desired boundaries
Solution Approach 2:
The poorly adhesive structure is designed to prevent the harmful effect of lateral undercut before it occurs. By providing a precisely trimmed boundary layer, it counteracts the tendency of material removal processes to create excessive lateral erosion, thereby preventing undercut rather than correcting it afterward
3Adaptability or versatility
If miniaturization is pursued with smaller contact spacing, then component functionality increases, but mechanical robustness and electrical reliability deteriorate
Solution Approach 1:
This principle is not directly applicable to the described patent. The patent focuses on precision cavity formation through controlled material removal and adhesive structure trimming, rather than using fluid pressure systems
Solution Approach 2:
The patent changes the physical and chemical parameters of the cavity formation process, including using poorly adhesive structures with specific trim characteristics and controlling removal parameters, to achieve high precision in miniaturized cavities. This enables reliable electrical connections and mechanical integrity even with smaller contact spacings
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high spatial accuracy in cavity formation, preventing excessive undercuts and improving mechanical integrity and electrical reliability, enhancing yield and signal quality, especially in high-frequency applications.
Implementation Method 1
thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure
Implementation Method 2
forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure
Data Source
AI summary
A method of manufacturing a component carrier includes forming a poorly adhesive structure on at least one layer structure, thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure, thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure, and forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure.