Through-Hole Substrate Wiring Without Plated Hole Walls
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Solution Overview
Problem
Conventional methods for electrically connecting circuit layers on substrates, such as chemical plating or electroplating, are complex, expensive, and environmentally polluting.
Innovation Solution
A substrate structure with through holes and conductive wires where the conductive wires extend from one surface to the other without direct contact with the hole walls, using conductive members to connect to pads on both surfaces, and optionally filled with organic materials to enhance electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chemical plating or electroplating process is used to form conductive film in holes, then electrical connection between circuit layers is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts the conductive wire from direct contact with the hole wall, allowing the wire to be suspended or indirectly supported within the hole. This eliminates the need for complex plating processes on the hole wall while maintaining electrical connection functionality through the conductive wire and conductive member assembly.
Solution Approach 2:
The conductive member acts as an intermediary between the conductive wire and the circuit layers. Instead of directly plating the hole wall to create electrical connection, the conductive member bridges the connection between the conductive wire ends and the circuit layers, simplifying the manufacturing process.
2Reliability
If chemical plating or electroplating process is used to form conductive film in holes, then electrical connection between circuit layers is achieved, but manufacturing cost increases
Solution Approach 1:
The invention uses simple conductive wires and conductive members that can be easily manufactured and replaced, eliminating the need for expensive chemical plating or electroplating processes. The conductive wire and conductive member assembly provides a cost-effective alternative to traditional plating methods.
3Reliability
If electroplating solution is used in conventional manufacturing method, then conductive film is formed in holes, but environmental pollution occurs
Solution Approach 1:
The invention extracts the electrical connection function from the electroplating process entirely. By using conductive wires and conductive members instead of electroplated conductive films, the harmful electroplating solution is eliminated from the manufacturing process, resolving the environmental pollution issue.
4Strength
If conductive wire directly contacts hole wall, then structural support is provided, but manufacturing complexity increases
Solution Approach 1:
The conductive member serves as an intermediary that provides structural support without requiring the conductive wire to directly contact the hole wall. The conductive member can be formed to extend along the conductive wire and provide mechanical support, simplifying the overall manufacturing process by decoupling the support function from the electrical connection function.
Data Source
AI summary
A substrate structure, a manufacturing method thereof, and an electronic device. The substrate structure includes a substrate, conductive wires and conductive members. Multiple through holes penetrate through the substrate body of the substrate. Multiple first conductive pads are arranged on the first surface of the substrate body. Multiple second conductive pads are arranged on the second surface of the substrate body. The conductive wires are accommodated in the through holes and each has a first end in the first opening of corresponding through hole and a second end in the second opening of corresponding through hole. The conductive members are distributed on the first and second surfaces, and both ends thereof are connected to the corresponding first and second conductive pads through the conductive members. At least part of each conductive wire does not contact the hole wall of each through hole in a direct manner.