PCB Cable Connector Organizer for Precise Interconnect Assembly

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Solution Overview

Problem

Existing methods for manufacturing electronic devices with cabled interconnects are inefficient and lack reliable alignment of connectors to substrates, particularly for high-performance applications, leading to potential performance issues.

Innovation Solution

A cabled interconnect subassembly is used, where connectors at one end are mounted to a substrate through a force direction, and a support holds the cables, allowing for separate manufacturing of the subassembly and substrate, with movable connectors and organizers for precise alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If connectors are mounted directly to substrates in traditional manufacturing methods, then assembly is simpler, but alignment precision and connection reliability deteriorate

Engineering Contradiction:
Improvealignment precisionVSAvoidassembly complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent introduces a subassembly as an intermediary component between connectors and substrates. The subassembly includes connectors mounted on a support structure with cable management features, allowing connectors to be pre-assembled and pre-aligned on the subassembly before being integrated to the substrate. This intermediary structure enables precise alignment while separating the complexity of connector assembly from substrate mounting.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent divides the traditional integrated connector-substrate assembly into separate segments: the subassembly (containing connectors and cable management structures) and the substrate. This segmentation allows independent manufacturing and optimization of each component, with the subassembly being manufactured separately and then integrated to the substrate, improving overall alignment precision and manufacturing efficiency.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If connectors and substrates are manufactured separately, then manufacturing flexibility improves, but alignment reliability deteriorates

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidalignment reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent implements preliminary action by pre-assembling connectors on the subassembly support structure before substrate integration. The subassembly is manufactured with connectors pre-positioned and pre-aligned on the support, with cable management structures pre-installed. This preliminary assembly ensures alignment reliability is established before the final substrate integration, allowing separate manufacturing while maintaining precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The subassembly acts as an intermediary that bridges separately manufactured connectors and substrates. The support structure on the subassembly provides precise positioning features that interface with the substrate, ensuring reliable alignment even when components are manufactured independently at different locations or times.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If traditional cable routing methods are used, then installation is simpler, but signal integrity and connection reliability deteriorate

Engineering Contradiction:
Improveconnection reliabilityVSAvoidcable management complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges cable management functions directly into the subassembly support structure. The support includes integrated features such as cable guides, clamps, or channels that manage cable routing and positioning. This merging of cable management into the structural support eliminates the need for separate cable management components, improving connection reliability while maintaining manageable complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The subassembly support structure serves as an intermediary between cables and the substrate, providing organized cable routing paths and secure attachment points. This intermediary structure ensures cables are properly positioned and managed, improving signal integrity and connection reliability without requiring complex external cable management systems.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12519277B2Method of using an organizer for manufacture of electronic device with cabled interconnects
Publication Date: 2026.01.06 AMPHENOL CORP
  • US12519277B2 patent drawing
  • US12519277B2 patent drawing
  • US12519277B2 patent drawing

AI summary

A method and subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via downward force. Second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. According to the method, the connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.