In-Line Interconnect Capacitors for Low-Inductance IC Connections

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Solution Overview

Problem

Capacitors placed far from integrated circuits cause parasitic inductance, leading to signal pollution with unwanted spikes and reduced signal quality.

Innovation Solution

Integrate interconnect capacitors in-line with solder bump interfaces to minimize distance to active circuitries, reducing noise and improving signal quality by forming a parallel plate capacitor with fringe effect.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If capacitors are placed far from integrated circuits, then ease of manufacture and layout flexibility improve, but parasitic inductance increases causing signal pollution

Engineering Contradiction:

Improvelayout flexibilityVSAvoidparasitic inductance and signal pollution

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent merges the capacitor with the trace structure by forming the capacitor directly on the trace using alternating conductive and dielectric layers. This integration allows the capacitor to be positioned at optimal locations along the trace (such as near the IC or at midpoint) without requiring separate component placement, thereby reducing parasitic inductance while maintaining manufacturing flexibility.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from planar capacitor placement to three-dimensional integration by stacking conductive and dielectric layers vertically along the trace. This multi-layer approach enables the capacitor to be embedded within the trace structure itself, achieving both compact positioning near the IC and flexible layout options without increasing horizontal footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If capacitors are integrated close to ICs, then parasitic inductance decreases and signal quality improves, but device complexity increases

Engineering Contradiction:

Improveparasitic inductance and signal qualityVSAvoidintegration complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The capacitor is merged with the existing trace structure by forming alternating conductive and dielectric layers directly on the trace. This integration uses the trace itself as part of the capacitor structure, eliminating the need for separate capacitor components and reducing overall device complexity while achieving optimal positioning near the IC.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The trace structure serves dual functions: as the signal transmission path and as part of the capacitor structure. The alternating conductive and dielectric layers formed on the trace create capacitance while the trace continues to carry signals, thereby achieving multiple functions with a single integrated structure and reducing overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If traditional surface-mount capacitors are used, then ease of manufacture improves, but trace length and parasitic inductance increase

Engineering Contradiction:

Improvestandard SMD assemblyVSAvoidtrace length and parasitic inductance

Core Design Contradiction:

Ease of manufactureVSLength of stationary object

Solution Approach 1:

The capacitor is merged with the trace structure by forming alternating conductive and dielectric layers directly on the trace, eliminating the need for separate SMD capacitor components. This integration allows the capacitor to be positioned optimally along the trace path, minimizing trace length and parasitic inductance while maintaining ease of manufacture through a unified fabrication process.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The capacitor structure is formed preliminarily during the trace fabrication process itself, before final assembly. By depositing alternating conductive and dielectric layers on the trace during manufacturing, the capacitor is pre-integrated into the structure, eliminating the need for subsequent SMD placement and enabling optimal positioning that minimizes trace length and parasitic inductance.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Minimizes parasitic inductance and enhances signal quality by integrating capacitors close to ICs, achieving higher capacitance and reducing trace length.

Implementation Method 1

Integrate an interconnect capacitor in-line with a solder bump interface of an integrated circuit (IC) package to minimize distance to active circuitries

Methodology Applied

Scientific EffectCapacitance: Capacitance

Implementation Method 2

forming a parallel plate capacitor with fringe effect

Methodology Applied

Scientific EffectFringe effect:

Data Source

PatentUS12526925B1Integrated circuit interconnects with integrated in-line capacitors

Publication Date: 2026.01.13 META PLATFORMS INC

AI summary

A system that includes improved integrated circuit interconnects integrated with interconnect capacitors that reduce noise and improve signal quality is disclosed. The system comprises a first circuit board layer including a contact region of a conductor trace. The system further comprises a second layer including an interconnect capacitor, wherein the interconnect capacitor comprises a first side coupled over at least a portion of the contact region of the first circuit board layer to form a contact pad on a second side of the interconnect capacitor configured to interface with an integrated circuit chip.