Liquid Metal Interconnect Wells for High-Density Server Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional server and package architecture face challenges in interconnecting processing units and components due to high mechanical loading forces, leading to increased area consumption, yield loss, and manufacturing costs, while non-permanent interconnects suffer from undesirable electrical properties.
Innovation Solution
The use of liquid metal interconnects (LMIs) with liquid metal well arrays provides a non-permanent connection between processor packages and motherboards, offering electrical properties comparable to solder connections without permanent attachment, allowing for high-density integration and reduced yield loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional mechanical interconnects (LGA socket) are used to maintain electrical connections, then electrical connectivity is achieved, but sustained mechanical loading force (300-600 lbf) is required which increases area consumption and baseboard space (15-20 square inches)
Solution Approach 1:
The patent replaces the traditional mechanical interconnect system (LGA socket requiring 300-600 lbf sustained force) with a liquid metal interconnect system that uses liquid metal wells to form electrical connections. This substitution eliminates the need for high mechanical loading forces and significantly reduces the area required on the baseboard, while maintaining reliable electrical connectivity between the processor package and baseboard.
2Adaptability or versatility
If the number of connections is increased to achieve high-density interconnect, then interconnect functionality is improved, but mechanical loading force and area consumption increase proportionally
Solution Approach 1:
The liquid metal interconnect system replaces the mechanical force-dependent connection method with a liquid metal-based connection method. This allows high-density interconnect functionality to be achieved without the mechanical loading force increasing proportionally, as the liquid metal wells can accommodate multiple connections without requiring proportionally higher sustained forces.
3Device complexity
If functionality is integrated into the processor package to reduce interconnections, then the number of external connections is reduced, but the physical size of the processor package increases requiring larger mechanical loading hardware
Solution Approach 1:
The liquid metal interconnect system provides a low-mechanical-loading alternative that enables processor packages with increased functionality and higher connection counts without requiring proportionally larger mechanical loading hardware. The liquid metal wells accommodate the increased connection density without the need for increased sustained mechanical forces.
4Area of stationary object
If components are placed in close proximity with compact interconnects to minimize mechanical loading impact, then area is reduced, but yield loss increases due to increased complexity
Solution Approach 1:
The liquid metal interconnect system uses liquid metal wells that can be easily refilled and replaced if defective components need to be substituted. This approach allows for compact component placement with close proximity interconnects while mitigating yield loss issues, as defective components can be replaced by refilling the liquid metal wells rather than requiring complex rework procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
LMIs enable high-density, flexible architecture with reduced mechanical loading, enabling easy replacement of defective components and maintaining electrical functionality, thus improving yield and reducing packaging costs.
Implementation Method 1
a first liquid metal well array attached to a surface of the processor package and attached to a first surface of the interposer and the interposer interconnect
Data Source
AI summary
An electronic system and associated methods are disclosed. In one example, the electronic system includes a processor package including at least one processor integrated circuit (IC); an interposer including electrically conductive interposer interconnect; a first liquid metal well array including multiple liquid metal wells arranged between the processor package and the interposer, wherein the first liquid metal well array is attached to a surface of the processor package and attached to a first surface of the interposer and the interposer interconnect; a printed circuit board (PCB) attached to a second surface of the interposer and the interposer interconnect; a second liquid metal well array including a first surface attached to the first surface of the interposer and the interposer interconnect; and a first companion component package attached to a second surface of the second liquid metal well array.