Mainboard Power Modules with CVD Insulation for Immersion Cooling
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Solution Overview
Problem
The 3D stacked structure in power processing units is prone to short circuits due to pollutants like dust and conductive particles, and immersion cooling methods risk circuit bridging, leading to functional failures and potential disasters, while traditional surface insulation methods fail to cover shadow areas effectively.
Innovation Solution
A mainboard design with a power supply module featuring a carrier plate, surface-mounted elements, and an insulating layer formed via chemical vapor deposition, which is thin, partially gaps-filled, and covers all surfaces including shadow areas, preventing short circuits and pollution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional surface insulation methods (spraying three-proofing paint) are used, then the insulation coverage is incomplete, but if immersion coating is used, then the risk of polluting connecting terminals exists
Solution Approach 1:
The insulating layer is selectively applied only to specific areas where insulation is needed (metal electrodes, connecting terminals, solder joints) rather than coating the entire surface. This localized insulation approach ensures complete coverage of critical areas without exposing non-critical areas to pollutant contamination from immersion coating processes.
Solution Approach 2:
The insulating layer is formed on the power supply module components before assembly onto the mainboard. This preliminary insulation treatment ensures that connecting terminals are protected before they could be exposed to immersion cooling pollutants, eliminating the need for post-assembly insulation applications.
2Reliability
If a thick insulating layer is used to ensure complete coverage, then heat dissipation performance deteriorates, but if a thin insulating layer is used, then insulation effectiveness is reduced
Solution Approach 1:
The thickness of the insulating layer is precisely controlled within a specific range (5-20 μm) to optimize the balance between insulation effectiveness and heat dissipation performance. This parameter optimization ensures sufficient electrical insulation while maintaining adequate thermal conduction through the insulating layer.
Solution Approach 2:
Different regions of the insulating layer may have different thickness characteristics, with thicker coverage on metal electrodes requiring higher insulation and thinner coverage on areas where heat dissipation is critical. This localized thickness variation optimizes both insulation and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short circuits and pollution, maintains heat dissipation performance, and allows for rapid and cost-effective repair, reducing environmental impact and operational downtime.
Implementation Method 1
the insulating layer is formed in a chemical vapor deposition mode
Data Source
AI summary
A mainboard includes at least one power supply module and a mainboard body. The power supply module is arranged on the mainboard body. The power supply module comprises at least one surface-mounted element, a carrier plate, and an insulating layer. The carrier plate is provided with a first surface and a second surface which are opposite to each other, and the surface-mounted element is arranged on the first surface and the second surface. The insulating layer is formed in a chemical vapor deposition mode; a gap is formed between the surface-mounted element and the carrier plate, the gap is not completely filled with the insulating layer, and the insulating layer is further at least partially arranged on the surface of the space where the gap is located.