Glass Through-Hole Waveguide Structure for Low-Loss Signal Transmission
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Solution Overview
Problem
Existing substrate integrated waveguides suffer from high material costs and signal attenuation due to limited material selection for dielectric layers in printed circuit boards, which are exacerbated by dielectric and metal losses, as well as signal leakage.
Innovation Solution
The use of a glass substrate with strategically patterned through holes and conductive layers to form a microstrip line-substrate integrated waveguide structure, reducing dielectric loss and enabling efficient high-frequency signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If printed circuit boards are used to form substrate integrated waveguides, then manufacturing is easier, but material selection for dielectric layers is limited and cost increases
Solution Approach 1:
The patent changes the fundamental parameter of the dielectric substrate material from conventional printed circuit board materials to glass ceramic materials. This material substitution enables access to a broader range of dielectric properties and performance characteristics, resolving the material selection limitation while maintaining manufacturing feasibility through established glass ceramic processing techniques
Solution Approach 2:
The patent employs composite material structures by combining glass ceramic substrates with metal layers and dielectric layers to form the substrate integrated waveguide. This composite approach allows optimization of each layer's properties independently, achieving both low dielectric loss and cost-effectiveness while overcoming the limitations of single-material printed circuit boards
2Loss of energy
If dielectric layers with small dissipation factor are selected to reduce signal attenuation, then signal transmission performance improves, but material options in printed circuit boards are limited and cost increases
Solution Approach 1:
The patent changes the dielectric substrate material to glass ceramic, which offers a broader range of dissipation factor values and dielectric constants compared to conventional printed circuit board materials. This enables selection of materials optimized for minimal signal attenuation at specific frequency ranges while maintaining cost-effectiveness and manufacturing feasibility
Solution Approach 2:
The patent applies different material properties to different regions of the waveguide structure by using glass ceramic substrates with specific dielectric properties in critical signal transmission areas. This localized optimization of material quality reduces signal attenuation where it matters most while maintaining overall cost-effectiveness
3Ease of manufacture
If conventional printed circuit board materials are used, then manufacturing cost is controlled, but signal attenuation increases due to dielectric loss
Solution Approach 1:
The patent changes the dielectric substrate material to glass ceramic, which offers superior dielectric properties with lower dissipation factors compared to conventional printed circuit board materials. This material substitution reduces dielectric loss and signal attenuation while maintaining manufacturing cost-effectiveness through established glass ceramic processing and economies of scale
4Reliability
If metal layers are used in waveguide structure, then electrical connection is achieved, but metal loss increases causing signal attenuation
Solution Approach 1:
The patent optimizes the metal layer configuration by using conductive materials strategically in specific regions where electrical connection is critical, while minimizing metal presence in areas where it would cause excessive loss. The glass ceramic substrate provides stable mechanical and electrical properties that support optimized metal layer designs with reduced overall metal content
Data Source
AI summary
An electronic device includes a glass substrate, a first metal layer, a second metal layer, and a third metal layer. The glass substrate includes a first surface, a second surface corresponding to the first surface, and at least two first through holes. The first through hole includes a third surface, and the third surface is connected to the first surface and the second surface. A first conductive layer is disposed on the first surface. A second conductive layer is disposed on the second surface. A third conductive layer is disposed on the third surface and is electrically connected to the first conductive layer and the second conductive layer. The first through hole has a major axis and a minor axis in a top view direction. A method of manufacturing the electronic device is also included.