Stacked Semiconductor Package Layout for RF Bandwidth Control
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Solution Overview
Problem
Radio-frequency front-end modules (RF FEMs) face challenges in shrinking size due to their multiple functions, making them incompatible with the ever-shrinking electronic products like mobile phones, as existing designs are relatively large and inflexible.
Innovation Solution
A semiconductor device design featuring a carrier with elements and electronic components, where a layer is used to compensate for height differences, allowing for a compact structure with bandwidth adjusting elements and an RF active device, enabling efficient signal processing and size reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic components are integrated to provide multiple functions, then the functionality and signal processing capability are improved, but the device size increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked architecture. Multiple electronic components (RF active device, bandwidth adjusting element, passive components) are vertically stacked above each other on the carrier, utilizing the vertical dimension to increase integration density while maintaining a compact footprint.
Solution Approach 2:
The patent implements a nested structure where the bandwidth adjusting element is positioned above the RF active device, and passive components are integrated into the same vertical space. This nesting allows multiple functional elements to occupy overlapping horizontal projections, effectively reducing the overall device area.
2Adaptability or versatility
If electronic components of different heights are integrated, then the device can accommodate various component types, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The patent introduces a reflowable filler material that can dynamically adapt its shape and volume. This material is disposed in void spaces between components of different heights and reflowed to fill gaps, automatically compensating for height variations and creating a stable, planar upper surface without requiring precise pre-positioning.
Solution Approach 2:
The filler material acts as an intermediary substance between electronic components of different heights. It fills the void spaces and provides mechanical support, enabling components with varying heights to be integrated into a unified structure while simplifying the manufacturing process.
3Volume of moving object
If a compact design is implemented, then the device size is reduced, but the space for signal processing and heat dissipation is limited
Solution Approach 1:
By utilizing vertical stacking, the patent achieves compact horizontal footprint while maintaining adequate volume for signal processing functions. The three-dimensional arrangement provides sufficient space for electromagnetic signal propagation and thermal management within a reduced overall device size.
Data Source
AI summary
A semiconductor device and a method of manufacturing a semiconductor device are provided. The semiconductor device includes a carrier, an element, and a first electronic component. The element is disposed on the carrier. The first electronic component is disposed above the element. The element is configured to adjust a first bandwidth of a first signal transmitted from the first electronic component.