Electronic Package Layout With Passive Components Between Substrates
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Solution Overview
Problem
Placing voltage regulation components on the land side of an electronic package occupies space that could otherwise be used for electrical contacts, increasing the size and height of the package and potentially reducing the performance of smaller passive components.
Innovation Solution
Locating passive components between two substrates of an electronic package, with one substrate offset from the other through an interposer, allowing for a reduced package size and increased performance without the need for a motherboard cavity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If voltage regulation components are placed on the land side of the electronic package, then the voltage regulation function is achieved, but the package size and height increase
Solution Approach 1:
The patent moves passive components from the traditional land side (horizontal plane) to the space between substrates (vertical dimension), utilizing the Z-axis space that was previously unused. This dimensional transition allows voltage regulation components to be positioned in the inter-substrate region, reducing their impact on the package's horizontal footprint and enabling better space utilization.
Solution Approach 2:
The patent nests passive components within the inter-substrate space, effectively placing one structural element (passive components) inside the space created by another (between substrates). This nesting approach allows the passive components to occupy the void space between the first and second substrates, reducing overall package height while maintaining all necessary functions.
2Reliability
If voltage regulation components are placed on the land side of the electronic package, then the voltage regulation function is achieved, but the area available for electrical contacts is reduced
Solution Approach 1:
The patent relocates passive components from the horizontal land side to the vertical inter-substrate space, freeing up the land side area for electrical contacts. This dimensional relocation resolves the spatial conflict between voltage regulation components and electrical contact areas.
Solution Approach 2:
The patent segments the electronic package into distinct functional zones: the land side is dedicated to electrical contacts, while the inter-substrate space houses passive components. This segmentation allows each area to be optimized for its specific function without interfering with the other.
3Length of stationary object
If the pitch of electrical contacts is increased to provide clearance for IVR components, then clearance is achieved, but the electrical contact density is reduced
Solution Approach 1:
By moving passive components to the inter-substrate vertical space, the patent eliminates the need to increase electrical contact pitch for clearance purposes. The clearance problem is solved in the Z-dimension rather than the XY-plane, allowing electrical contacts to maintain high density.
Solution Approach 2:
The patent effectively creates a copy of the clearance function in a different spatial location - instead of providing horizontal clearance between IVR components and motherboard, the design provides vertical separation between substrates, achieving the same clearance objective without sacrificing contact density.
Data Source
AI summary
An electronic package with passive components located between a first substrate and a second substrate. The electronic package can include a first substrate including a device interface for communication with an electronic device. An interposer can be electrically coupled to the first substrate. A second substrate can be offset from the first substrate at a distance. The second substrate can be electrically coupled to the first substrate through the interposer. A passive component can be attached to one of the first substrate or the second substrate. The passive component can be located between the first substrate and the second substrate. A height of the passive component can be is less than the distance between the first substrate and the second substrate. The second substrate can include a die interface configured for communication with a die. The die interface can be communicatively coupled to the passive component.