Conveyance Claw Solder Removal Mechanism for Jet Soldering
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Solution Overview
Problem
Existing methods for removing solder adhering to conveyance claws in jet soldering apparatuses are inadequate, particularly for compositions with strong adhesive forces, such as Sn-58Bi, where brushes and hot air are ineffective.
Innovation Solution
A solder removing mechanism comprising an abutment body that can pass through or under the conveyance claws, combined with a brush on the downstream side, effectively scrapes off solder using abutment plates with bent ends to ensure reliable removal, and a guide part directs the solder to a storage tank.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a removal brush or hot air blowing nozzle is used to remove solder from conveyance claws, then the removal process is simple and low-cost, but solder with strong adhesive force (e.g., Sn-58Bi) cannot be effectively removed
Solution Approach 1:
The removal mechanism is segmented into multiple functional components: an abutment body with first and second abutment portions that contact different surfaces of the conveyance claw, and a brush positioned downstream. This segmentation allows each component to perform a specific removal function, enabling effective solder removal while maintaining structural simplicity.
Solution Approach 2:
The abutment body acts as an intermediary mechanical element between the conveyance claw and the solder. By positioning the abutment body to contact the conveyance claw during removal, it transfers mechanical force to dislodge adhered solder, serving as a mediator that enhances removal effectiveness without requiring complex mechanisms.
2Reliability
If solder is not reliably removed from conveyance claws, then the conveyance system can operate continuously, but solder accumulates on the claws causing clogging and operational failures
Solution Approach 1:
The removal mechanism performs preliminary action by removing solder from the conveyance claw before the claw returns to its starting position. The abutment body and brush are positioned to contact and remove solder during the conveyance cycle, preventing accumulation before it causes clogging or operational failure.
Solution Approach 2:
The mechanism converts the potentially harmful effect of solder adhesion into a beneficial removal process. By using the abutment body to deliberately contact and scrape the conveyance claw surfaces where solder adheres, the system transforms the problem of strong adhesion into an opportunity for effective mechanical removal, preventing harmful accumulation.
3Reliability
If the abutment body is designed to contact conveyance claws for solder removal, then solder removal effectiveness improves, but the risk of interfering with substrate conveyance increases
Solution Approach 1:
The abutment body is designed with local quality differentiation through its first and second abutment portions, each positioned to contact specific local areas of the conveyance claw. This localized contact approach enables effective solder removal from specific surfaces while avoiding interference with the substrate conveyance function, as each portion is strategically positioned for its specific removal task.
Solution Approach 2:
The removal mechanism operates in a different spatial dimension than the substrate conveyance. The abutment body contacts the conveyance claw from a direction and position that is separate from the substrate path, allowing solder removal to occur in another dimension without interfering with the primary conveyance function.
Data Source
AI summary
A solder removing mechanism 520 is a solder removing mechanism for removing solder from conveyance claws 510 for conveying a substrate 200 to which the solder is supplied. The solder removing comprise an abutment body 530 that can relatively pass through recesses 511 of the conveyance claws 510 or below the conveyance claws 510.