Lead Component Soldering Parameter Control for Defect Reduction
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Solution Overview
Problem
The existing soldering devices do not account for the unique parameter values of different lead components, leading to an increased probability of soldering defects.
Innovation Solution
A soldering device that identifies the type of lead component and adjusts soldering parameters such as flux heating time, solder application time, solder withdrawal speed, solder curing waiting time, tracing soldering speed, height of the soldering device, and jetting height of molten solder, using a memory system to store correspondences between lead component types and their respective parameter values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the same soldering parameter value is used for all lead component types, then the device complexity is reduced and operation is simplified, but soldering defects increase due to inability to account for component-specific requirements
Solution Approach 1:
The patent applies parameter changes by storing different soldering parameter values (such as heating time, solder application time, withdrawal speed) in a memory unit corresponding to different lead component types. The control unit retrieves and applies the appropriate parameter set based on the specific component type being soldered, allowing optimization of soldering quality for each component without manual intervention.
Solution Approach 2:
The system implements self-service through automatic parameter selection. The control unit automatically identifies the lead component type and retrieves the corresponding parameter values from memory without requiring operator input or manual parameter adjustment. This automation maintains high soldering quality while minimizing the operational burden on users.
2Manufacturing precision
If multiple parameter values are stored and managed for different lead component types, then soldering quality improves, but the device complexity and operational complexity increase
Solution Approach 1:
The control unit automatically performs parameter selection based on lead component type identification. The system serves itself by autonomously retrieving the correct parameter set from memory and applying it to the current soldering operation, eliminating the need for operators to manually select or adjust parameters for different component types.
Solution Approach 2:
The patent replaces manual parameter adjustment (mechanical/operator-based system) with an automated electronic control system. The control unit electronically retrieves and applies parameter values from memory based on component type, substituting the need for manual intervention and simplifying the operator's role to merely overseeing the automated process.
3Temperature
If flux is preheated before component mounting, then flux activation is improved, but flux temperature decreases during mounting process causing flux deactivation
Solution Approach 1:
The system performs preliminary flux heating before component mounting to activate the flux. By preheating the flux in advance, the system ensures proper flux activation and chemical readiness for soldering, addressing the temperature requirement before the component is actually mounted and soldered.
Solution Approach 2:
The patent applies parameter changes by adjusting the heating time parameter based on lead component type. The control unit retrieves the appropriate heating time from memory and applies it to the flux heating process, dynamically changing the thermal parameters to match specific component requirements and maintain flux activation reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures that each lead component is soldered with the appropriate parameters, reducing soldering defects and improving the efficiency of the soldering process by integrating the soldering device with a component mounting device, reducing size and cost, and minimizing working time.
Implementation Method 1
a gas injecting section configured to inject a nitrogen gas heated by making use of a heat of the molten solder
Implementation Method 2
the nitrogen gas heated by the heat of the molten solder is applied to the flux or the periphery thereof to heat and activate the flux
Data Source
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AI summary
A control device of soldering device 60 identifies the type of lead component to be soldered when soldering multiple types of lead components sequentially with jet device 62 and reads out a value of a soldering parameter corresponding to the lead component type from an HDD. Then, the control device controls jet device 62 so that the lead component is soldered based on the value of the soldering parameter. As a result, the lead of the lead component is soldered with the value of the soldering parameter corresponding to the type of the lead component.