Package Substrate Build-Up Without Core Cavity Embedding
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Solution Overview
Problem
The existing semiconductor packaging process is costly and time-consuming due to the complexity of embedding components in a core board, leading to component scrapping and increased production costs.
Innovation Solution
A method for manufacturing a package substrate that involves processing an adhesive photosensitive material on an inner substrate to create a first insulating dielectric layer, mounting a component on this layer, and then processing a photosensitive packaging material to form a second insulating dielectric layer covering the component, without the need for cavity processing, thereby reducing processing time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are embedded in the cavity of the core board, then the package substrate achieves high integration and miniaturization, but the processing time increases and the risk of component scrapping increases
Solution Approach 1:
Instead of embedding components in cavities of the core board and then building up layers, this patent inverts the sequence by first forming insulating dielectric layers on the core board, then mounting components on these layers. This reversal eliminates the need for cavity processing and subsequent build-up operations, significantly reducing processing time while maintaining miniaturization benefits.
2Adaptability or versatility
If components are embedded in the cavity of the core board, then the package substrate achieves high integration, but the complexity of the technological process increases
Solution Approach 1:
This patent extracts and eliminates the complex cavity processing step from the traditional embedding process. By removing the requirement to form cavities in the core board and subsequent build-up layers, the process complexity is significantly reduced while the component integration capability is preserved through direct mounting on insulating dielectric layers.
3Ease of manufacture
If multiple build-up layers are processed, then the package substrate structure is completed, but the cost increases due to component scrapping
Solution Approach 1:
This patent performs preliminary actions by first forming the insulating dielectric layers on the core board before mounting components. This preliminary structure provides a stable foundation for component placement, eliminating the need for subsequent build-up operations that could cause damage. Components are mounted in a safe position from the beginning, preventing scrapping during later processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of component scrapping, decreases processing time and costs, and facilitates miniaturization by simplifying the packaging process and improving the quality of blind holes for better electrical connections.
Implementation Method 1
processing an adhesive photosensitive material on a surface of a first side of the inner substrate to obtain an adhesive first insulating dielectric layer
Implementation Method 2
processing a photosensitive packaging material on the first side of the inner substrate to obtain a second insulating dielectric layer, where the second insulating dielectric layer covers the component
Data Source
AI summary
A package substrate and a manufacturing method thereof are disclosed. The method includes: providing an inner substrate; processing an adhesive photosensitive material on a surface of a first side of the inner substrate to obtain an adhesive first insulating dielectric layer; mounting a component on the first insulating dielectric layer; and processing a photosensitive packaging material on the first side of the inner substrate to obtain a second insulating dielectric layer, where the second insulating dielectric layer covers the component.