3D-Movable Flow Tank Layout for Easier Soldering Maintenance
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Solution Overview
Problem
Existing electronic component mounting devices face challenges in maintaining the flow tank accommodating a viscous fluid and require a larger apparatus size due to the fixed positioning of the board and flow tank movement systems.
Innovation Solution
The electronic component mounting device incorporates a flow tank that can be moved in three orthogonal directions outside the component mountable region, facilitating maintenance and reducing the apparatus size by allowing the flow tank to be positioned outside the component mounting area, and utilizing a three-dimensional moving device for the flow tank.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If the flow tank is fixed in position within the component mounting area, then the apparatus structure is simplified, but maintenance of the flow tank becomes difficult and apparatus size increases
Solution Approach 1:
The flow tank is made movable rather than fixed, allowing it to be dynamically repositioned between the component mounting area and a maintenance area. This dynamic positioning capability enables easy access for maintenance while optimizing space utilization during operation.
Solution Approach 2:
The flow tank movement system utilizes three-dimensional motion capabilities to reposition the flow tank not only horizontally but also vertically, allowing it to move below the component mounting area. This multi-dimensional movement approach reduces the horizontal footprint of the apparatus while maintaining full accessibility for maintenance.
2Ease of repair
If the flow tank is made movable to facilitate maintenance, then ease of repair is improved, but device complexity increases
Solution Approach 1:
The flow tank moving device is designed to perform multiple functions: positioning the flow tank during component mounting operations, transporting it to maintenance areas, and enabling easy removal for inspection or replacement. This multi-functionality reduces the need for separate dedicated mechanisms for each operation.
Solution Approach 2:
The flow tank moving device is integrated with the board three-dimensional moving device, combining their functions into a unified system. This integration shares structural components, control systems, and space, thereby reducing overall device complexity while achieving both board positioning and flow tank movement capabilities.
Data Source
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AI summary
Maintenance of a flow tank is facilitated. A sub-module 12 is provided adjacent to a main module 10. A board is introduced in the sub-module 12, and is heated by a heater 352 that is at a heating position, is moved to the main module 10, solder is applied by a flow tank 206 in parallel with insertion of a component by a component insertion device 22, and thereby the component is mounted. If a maintenance condition is established, introduction of boards is stopped, the heater 352 is moved to a standby position, and the flow tank 206 is moved to a maintenance position of the sub-module 12. Maintenance is performed on the flow tank 206 and since the component insertion device 22 is not present above the flow tank 206, it is possible to facilitate inspection, removal, and the like of the flow tank 206.