Connected Component Carrier With Fluid Cooling for Dense Electronics
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Solution Overview
Problem
The increasing miniaturization and complexity of electronic components on component carriers, such as printed circuit boards, lead to heat generation issues, limiting the performance and reliability of electronic devices, as existing cooling methods are inefficient and may introduce thermal resistance and electrical interference.
Innovation Solution
An electronic device design featuring a component carrier with a stack of conductive and insulating layers, integrated with a cooling member containing a fluid cooling unit, connected via a metallic structure for efficient heat transfer, eliminating the need for external heat sinks and enhancing mechanical and thermal coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are miniaturized and densely packed on component carriers, then device functionality and integration are improved, but heat generation increases and heat removal becomes more difficult
Solution Approach 1:
The patent merges the component carrier and cooling member into a single integrated structure, where the component carrier serves dual purposes as both an electrical connection substrate and a heat dissipation component. The metallic connection structure is formed directly on the component carrier, eliminating the need for separate cooling components and reducing thermal resistance between the electronic component and cooling fluid.
Solution Approach 2:
The component carrier is designed to perform multiple functions simultaneously: providing electrical connections through conductive layers, mechanical support through insulating layers, and heat dissipation through the metallic connection structure. This multi-functional design allows efficient heat removal while maintaining device functionality in a compact form.
2Temperature
If conventional cooling methods are used, then heat removal is attempted, but thermal resistance increases and electrical interference occurs
Solution Approach 1:
The cooling fluid acts as an intermediary heat transfer medium, absorbing heat from the metallic connection structure and carrying it away from the electronic component. This fluid-based cooling mechanism provides efficient heat removal while maintaining electrical isolation, as the cooling fluid does not create electrical interference unlike conventional solid cooling methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat removal from electronic components, improving device performance and reliability by reducing thermal resistance and preventing electrical interference, while maintaining a compact and flexible design suitable for high-power applications.
Implementation Method 1
the component carrier and the cooling member are connected by a (for example metallic) connection structure (which, for example, contributes to a heat removal from the electronic component to the cooling unit)
Implementation Method 2
a cooling member with a fluid cooling unit at least partially therein
Data Source
AI summary
An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.