Semiconductor Metal Block Layout for PCB Heat Dissipation and Insulation
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Solution Overview
Problem
Standard circuit boards fail to simultaneously achieve the required electrical insulation and adequate heat dissipation for power semiconductor components, particularly in applications with high power losses and strict insulation coordination standards, due to limitations in copper layer thickness and thermal via usage.
Innovation Solution
A semiconductor component arrangement with a metal block between the component and the printed circuit board, connected via solder joints to both the component and the circuit board, enhancing thermal conductivity and insulation by promoting wider heat conduction and thermal buffering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If standard printed circuit board copper layers and thermal vias are used for heat dissipation, then the structure remains simple and manufacturing is easy, but the heat dissipation capability is insufficient for high power loss applications
Solution Approach 1:
The patent introduces a metal block as an intermediary component between the power semiconductor component and the printed circuit board. This metal block serves as a thermal mediator that enhances heat transfer from the component to the PCB, resolving the contradiction by providing superior heat dissipation capability while maintaining a relatively simple overall structure through the addition of a single intermediate element.
2Loss of energy
If thermal vias are used to dissipate heat through the printed circuit board, then heat dissipation path is established, but electrical insulation requirements cannot be satisfied due to conductive nature of thermal vias
Solution Approach 1:
The metal block acts as a thermal intermediary that can be electrically isolated from the PCB using insulating materials such as ceramic coatings or plastic insulation layers. This allows heat to be transferred effectively while maintaining electrical insulation, as the metal block serves purely as a thermal conduction path without creating electrical conductive paths through the PCB.
Solution Approach 2:
The heat dissipation function is segmented from the electrical conduction function. The metal block handles thermal conduction while separate insulating layers handle electrical isolation, allowing both heat dissipation and insulation requirements to be satisfied independently without conflict.
3Loss of energy
If copper layer thickness is increased to improve heat dissipation, then thermal conductivity improves, but manufacturing precision and standard PCB fabrication processes are compromised
Solution Approach 1:
The metal block serves as a dedicated thermal management intermediary with optimized thickness and material properties (such as copper or aluminum) that can be precisely controlled during manufacturing. This separates the thermal conductivity requirement from the PCB fabrication process, allowing high thermal performance without compromising standard PCB manufacturing precision for copper layers.
4Reliability
If insulation layers are added to meet electrical insulation standards, then insulation compliance is achieved, but heat dissipation path is interrupted and thermal resistance increases
Solution Approach 1:
The metal block positioned between the semiconductor component and the PCB creates a dedicated thermal conduction path that can be insulated electrically without interrupting heat flow. Insulation layers can be applied to the metal block's surfaces facing electrical components, while the block's internal structure maintains efficient thermal conduction, thus satisfying both insulation compliance and heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation and insulation compliance, effectively managing short-term power peaks and heat propagation, while meeting insulation standards, using standard printed circuit boards.
Implementation Method 1
A semiconductor component arrangement with a metal block between the component and the printed circuit board, connected via solder joints to both the component and the circuit board, enhancing thermal conductivity and insulation by promoting wider heat conduction
Implementation Method 2
connected via solder joints to both the component and the circuit board
Data Source
AI summary
A heat dissipation device for soldering onto a printed circuit board for a semiconductor component arrangement. The device includes a semiconductor component a first electrical connector and at least one further electrical connector and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.