Thermistor PCB Layout for Accurate Rear Housing Temperature Sensing
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Solution Overview
Problem
Conventional electronic devices face challenges in accurately measuring internal temperatures due to thermistors being mounted with other components on the PCB, leading to inaccurate temperature readings and a significant difference between internal and external temperatures, which can affect temperature control and user safety.
Innovation Solution
The solution involves positioning thermistors on a flexible PCB separate from the main PCB to directly measure the temperature of the housing and battery, using a thermistor disposed adjacent to the rear surface of the housing, with additional structures to prevent heat transfer and physical contact, allowing for accurate temperature sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the thermistor is mounted on the main PCB together with other components, then the device complexity is reduced, but the temperature measurement precision deteriorates due to heat interference from peripheral components
Solution Approach 1:
The patent divides the PCB into two separate boards: a main PCB for mounting heat-generating components (processor, memory) and a flexible PCB for mounting the thermistor. This segmentation isolates the temperature sensing function from heat-generating components, eliminating thermal interference and improving measurement precision without significantly increasing overall device complexity.
Solution Approach 2:
The thermistor is extracted from the main PCB and relocated to a separate flexible PCB positioned adjacent to the housing. This extraction removes the thermistor from the thermal environment created by peripheral components on the main PCB, enabling accurate temperature measurement of the housing and battery without interference from nearby heat sources.
2Speed
If the thermistor is positioned close to the housing to measure external temperature, then the temperature control responsiveness is improved, but the internal temperature measurement accuracy deteriorates due to heat transfer from internal components
Solution Approach 1:
The flexible PCB acts as an intermediary structure between the main PCB and the housing. The thermistor mounted on this intermediate board can sense the temperature of the housing (external temperature) while being electrically connected to the main PCB for data processing. This intermediary positioning allows the thermistor to accurately measure the temperature at the interface between internal and external environments without being directly exposed to heat from internal components.
3Measurement precision
If the thermistor directly contacts the housing to measure temperature, then the measurement precision is improved, but the reliability deteriorates due to physical contact and heat transfer issues
Solution Approach 1:
The patent uses a flexible PCB as a thin film structure to mount the thermistor. This flexible substrate allows the thermistor to be positioned extremely close to the housing surface, achieving high measurement precision through thermal proximity, while the flexible nature of the PCB prevents rigid physical contact that could cause mechanical damage or unreliable electrical connections, thereby maintaining sensing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise temperature measurement of the housing and battery, improving temperature control and user safety by minimizing heat transfer and physical impact, ensuring accurate feedback to the user.
Implementation Method 1
a thermistor mounted on a second board; a processor mounted on a first board and configured to determine a temperature of the housing based on an electrical signal received from the second board
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
The present application concerns an electronic device comprising a housing including a rear housing forming an external shape of the electronic device, a first board disposed in a first direction from the rear housing of the housing, wherein at least one processor is mounted at the first board, a second board disposed between the rear housing and the first board and electrically connected with the first board, the second board being spatially separated from the rear housing, a thermistor mounted on the second board, wherein the thermistor is disposed at a surface of the second board in a second direction that is towards the rear housing, the second direction being opposite to the first direction, and at least one first structure for securing a disposition space in which the thermistor is disposed, wherein the disposition space is configured to block heat generated at adjacent other spaces of the electronic device, wherein the at least one first structure is configured to support a pressure in the first direction and/or the second direction to prevent a physical impact and/or to block heat transferred from the outside to the disposition space, and wherein the at least one processor is configured to determine, based on an electrical signal from the thermistor, a temperature of the rear housing detected by the thermistor.