Through-Flow PCB Heat Dissipation Structure for Low Power Loss

The patent transitions from planar 2D copper foil power networks to 3D vertical power networks by extending conductive members through the PCB thickness direction. This dimensional change allows power networks to utilize the Z-axis space, effectively increasing power network capacity without adding more PCB layers, thus resolving the contradiction between cost reduction and power network space constraints.

The patent combines power transmission and heat dissipation functions into a single integrated structure. The conductive members that carry current also serve as heat dissipation pathways, merging two previously separate functions. This reduces the need for additional dedicated heat dissipation structures, simplifying the overall PCB layer structure while addressing both power loss and thermal management.

The patent segments the power network into multiple vertical conductive members distributed throughout the PCB thickness. Instead of concentrating all power transmission in the surface layer, the current path is divided into multiple parallel vertical pathways extending from surface to inner layers. This segmentation distributes heat generation across multiple locations and improves heat dissipation while maintaining low power loss.

The patent extends power transmission from the 2D surface layer into the 3D vertical dimension by creating conductive members that traverse the PCB thickness. This allows heat to be conducted away from the hot surface layer into the cooler interior of the PCB, improving heat dissipation performance while maintaining efficient current transmission.