Polymer Compact Wiring Assembly With Resin-Assisted Solder Bonding
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Solution Overview
Problem
Current methods for forming copper wiring on polymer compacts face productivity issues due to expensive catalyst-containing polymers and require laser radiation and electroless copper plating, while methods using metal pastes suffer from inadequate adhesion, leading to degraded adhesion strengths in electronic components.
Innovation Solution
A method involving applying a metal paste with metal particles onto a polymer compact, sintering to form a metal wiring, applying a solder paste with solder particles and resin onto the wiring, and heating to bond an electronic element with a solder layer, followed by a resin layer for enhanced adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser direct structuring (LDS) is used to form copper wiring on polymer compact, then selective metal plating can be achieved with prescribed pattern, but productivity decreases due to expensive catalyst-containing polymers and required laser radiation and electroless copper plating steps
Solution Approach 1:
The invention extracts and eliminates the catalyst-containing polymer step from the LDS process. Instead of using expensive polymers with embedded catalysts that require laser activation, the patent applies metal paste directly to ordinary polymer compacts, removing the problematic catalyst layer and simplifying the overall manufacturing process while maintaining pattern precision.
Solution Approach 2:
The invention replaces expensive catalyst-containing polymers with ordinary, inexpensive polymer compacts. The metal paste serves as a temporary precursor that is sintered away to form the final metal wiring, effectively using a disposable intermediate material to achieve the desired structure without requiring costly base materials.
2Ease of manufacture
If metal paste is applied onto polymer compact and calcinated to form metal wiring, then formation process is simplified, but adhesiveness between polymer compact and metal wiring cannot be sufficiently obtained
Solution Approach 1:
The invention introduces a resin layer as an intermediary between the metal wiring and the polymer compact. This resin layer, applied after sintering, acts as a bonding mediator that enhances adhesion between the metal wiring and the substrate, resolving the adhesion problem while maintaining the manufacturing simplicity of the paste application method.
Solution Approach 2:
The invention creates a composite structure consisting of the polymer compact, metal wiring, and resin layer. This multi-material composite approach combines the advantages of each material: the polymer provides structural support, the metal provides conductivity, and the resin provides strong adhesion, achieving both ease of manufacture and sufficient adhesion strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables easy formation and mounting of metal wiring and electronic elements with improved adhesion between the polymer compact and metal wiring, bypassing the need for costly catalysts and laser radiation, and enhancing the structural integrity of electronic components.
Implementation Method 1
a second step of sintering the metal particles to form a metal wiring
Implementation Method 2
a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element
Implementation Method 3
a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer
Data Source
AI summary
One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.