Conductive Resin Electronic Module Assembly for Impact-Resistant Positioning
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Solution Overview
Problem
Existing electronic modules using solder joints are prone to positional deviation and impact damage, especially in applications requiring high positional accuracy, and cannot be used with components having low heat resistance due to the need for high-temperature soldering processes.
Innovation Solution
An electronic module design utilizing conductive resin portions and reinforcing resin portions to join electronic components with a wiring board, eliminating solder and allowing for impact resistance and high positional accuracy without high-temperature processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is used to join electrodes, then electrical connectivity is achieved, but the structure becomes vulnerable to impact and positional deviation occurs
Solution Approach 1:
The patent changes the material parameter from solder to conductive resin, which fundamentally alters the mechanical properties of the joining material. The conductive resin provides both electrical conductivity and mechanical cushioning, eliminating the brittleness of solder while maintaining electrical connectivity. This parameter change resolves the contradiction by making the joining material inherently more impact-resistant while maintaining positioning accuracy through controlled curing.
Solution Approach 2:
The patent uses composite materials by combining conductive resin with reinforcing resin. The conductive resin provides electrical connectivity and shock absorption, while the reinforcing resin adds structural strength and positional stability. This composite approach simultaneously improves impact resistance and maintains manufacturing precision, resolving the technical contradiction between reliability and positional accuracy.
2Reliability
If soldering process is used to join electrodes, then electrical connectivity is achieved, but high temperature processing is required which damages heat-sensitive components
Solution Approach 1:
The patent replaces the thermal joining process (soldering) with a chemical joining process using conductive resin. Instead of using heat to melt and bond solder, the conductive resin is applied in an uncured state, allows electrodes to be positioned, and then cures at low temperature to form strong electrical and mechanical bonds. This substitution eliminates high-temperature processing while maintaining reliable electrical connectivity.
Solution Approach 2:
The patent changes the temperature parameter of the joining process from high temperature (soldering requires melting point of solder, typically 180-250°C) to low temperature (conductive resin curing can be done at 50-100°C or even room temperature). This parameter change enables the joining of heat-sensitive components without damage while maintaining electrical connectivity through the conductive properties of the cured resin.
3Reliability
If solder is used for joining, then electrical connectivity is achieved, but large impact is transferred to the electronic component causing deviation
Solution Approach 1:
The patent applies beforehand cushioning by using conductive resin as an intermediate layer between the electrodes and the wiring board. This resin layer acts as a shock absorber that cushions impact forces before they reach the electronic component. The viscoelastic properties of the cured resin allow it to absorb and dissipate impact energy, protecting the component from damage while maintaining electrical connectivity through its conductive pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides enhanced resistance to impact and maintains positional accuracy, reducing the risk of component deviation and enabling use with components sensitive to heat, while maintaining electrical connectivity.
Implementation Method 1
a conductive resin portion including at least one first conductive resin portion joining the first electrode with the third electrode, and at least one second conductive resin portion joining the second electrode with the fourth electrode
Implementation Method 2
at least one reinforcing resin portion joining the first principal surface of the electronic component with the second principal surface of the wiring board
Data Source
AI summary
An electronic module includes at least one electronic component including a first principal surface, first and second electrodes on the first principal surface, a wiring board including a second principal surface, third and fourth electrodes on the second principal surface, and a conductive resin portion. The conductive resin portion includes at least one first conductive resin portion joining the first and third electrodes, and at least one second conductive resin portion joining the second and fourth electrodes. The electronic module further includes at least one reinforcing resin portion that is disposed between at least one first and at least one second conductive resin portions and joins the first principal surface of the electronic component with the second principal surface of the wiring board.