Grooved Soldering Structure for Power Module Overflow Control

Solution Overview

Problem

Conventional soldering methods for power modules can cause solder overflow, leading to stress on substrates and potential damage due to thermal shock, as excessive solder penetrates into pattern boundaries and affects cooling performance.

Innovation Solution

A soldering structure featuring a metal layer with a bonding area and a groove portion around it, including dimples that confine molten solder to side surfaces, preventing overflow and stress on substrates, using materials with excellent solder wettability like copper, silver, or nickel.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If a large amount of solder is provided to control the height of the power module, then the height can be adjusted, but solder may overflow and cause stress on the substrate leading to potential damage

Engineering Contradiction:

Improveheight of power moduleVSAvoidsubstrate integrity

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

The bonding area is segmented by introducing groove portions that divide the solder flow into distinct regions. These grooves create separate zones that control solder distribution, preventing uncontrolled overflow while maintaining adequate height control through managed solder placement.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The groove portions act as intermediary structures between the bonding area and the surrounding substrate. These grooves intercept and redirect solder flow before it can reach the substrate boundaries, serving as a protective mediator that prevents direct contact between excessive solder and the substrate edges.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Length of stationary object

If solder overflows around the bonding area, then the height of the power module is reduced, but solder penetrates into pattern boundaries and adds stress to the substrate

Engineering Contradiction:

Improveheight of power moduleVSAvoidstress on substrate from solder penetration

Core Design Contradiction:

Length of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The bonding area is segmented by introducing groove portions that divide the solder flow into distinct regions. These grooves create separate zones that control solder distribution, preventing uncontrolled overflow while maintaining adequate height control through managed solder placement.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The groove portions convert the potentially harmful solder overflow into a beneficial controlled flow pattern. By providing designated pathways through the grooves, the solder that would otherwise be harmful is redirected to serve the useful function of height control without causing damage to surrounding structures.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Length of stationary object

If solder is allowed to flow freely to control height, then height adjustment is achieved, but cooling performance may be reduced due to molding material penetration

Engineering Contradiction:

Improveheight of power moduleVSAvoidcooling performance

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

The bonding area is segmented by introducing groove portions that divide the solder flow into distinct regions. These grooves create separate zones that control solder distribution, preventing uncontrolled overflow while maintaining adequate height control through managed solder placement.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the bonding area are given different properties through the groove portions. The areas within the grooves have controlled solder accumulation characteristics, while the grooves themselves have flow-directed properties, creating local quality variations that optimize both height control and protection against molding material penetration.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Minimizes solder overflow, maintains substrate integrity by directing solder flow along side surfaces, preventing deformation and thermal shock-induced damage, while allowing for height adjustment without compromising module operation or durability.

Implementation Method 1

a component to be soldered and a metal layer having a bonding area, to which the component to be soldered is bonded by solder

Methodology Applied

Scientific EffectSolder wettability: Wetting

Implementation Method 2

A soldering structure featuring a metal layer with a bonding area and a groove portion around it, including dimples that confine molten solder to side surfaces

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS11862537B2Soldering structure with groove portion and power module comprising the same

Publication Date: 2024.01.02 HYUNDAI MOTOR CO LTD

AI summary

A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.