Vapor Passage Hole Layout for Uniform Substrate Reflow Heating
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Solution Overview
Problem
The vapor phase soldering method faces challenges in achieving uniform heat transfer across the entire surface of a substrate due to differences in vapor supply to the central and peripheral regions, leading to inefficiencies in the solder reflow process.
Innovation Solution
The method involves forming vapor passage holes of varying diameters in specific regions of the substrate, with larger holes in the central region and smaller holes in the peripheral region, allowing vapor to be supplied uniformly through these holes for efficient heat transfer during the solder reflow process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If vapor phase soldering is used to provide uniform temperature distribution, then overheating is prevented, but uniform heat transfer across the entire substrate surface is difficult due to different vapor supply amounts to central and peripheral regions
Solution Approach 1:
The patent applies local quality by creating different hole diameters in different regions of the substrate. The central region has larger diameter holes to increase vapor supply, while the peripheral region has smaller diameter holes to control vapor supply. This regional differentiation ensures uniform vapor distribution and heat transfer across the entire substrate surface, resolving the contradiction between temperature uniformity and heat transfer efficiency.
2Productivity
If vapor is supplied uniformly across the substrate, then heat transfer efficiency improves, but the natural vapor distribution in conventional ovens is uneven between central and peripheral regions
Solution Approach 1:
The patent applies asymmetry by deliberately creating non-uniform hole diameters across the substrate - larger holes in the central region and smaller holes in the peripheral region. This asymmetric design compensates for the natural uneven vapor distribution in conventional ovens, where the central region typically receives more vapor. The asymmetric hole pattern balances the vapor supply across the substrate, achieving uniform heat transfer and improving both heat transfer efficiency and soldering precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures uniform heat transfer across the substrate, reducing defects in fine-pitch solder reflow and improving joint quality.
Implementation Method 1
heating a first heat transfer fluid to generate a second heat transfer fluid in a vapor state
Implementation Method 2
supplying at least a portion of the second heat transfer fluid in the vapor state through the vapor passage holes of the substrate; and soldering the bumps using the at least the portion of the second heat transfer fluid in the vapor state
Data Source
AI summary
A method of manufacturing an electronic device, includes: providing a substrate including a plurality of mounting regions on which electronic components are mounted respectively; forming a plurality of vapor passage holes that penetrate the substrate; disposing the electronic components on the substrate via bumps; heating a first heat transfer fluid to generate a second heat transfer fluid in a vapor state; supplying at least a portion of the second heat transfer fluid in the vapor state through the vapor passage holes of the substrate; and soldering the bumps using the at least the portion of the second heat transfer fluid in the vapor state.