Orthogonal Surface Connector Using Pillars and Conductive Ball
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Solution Overview
Problem
Existing connectors in electronic systems and devices face challenges in efficiently connecting contacts arranged on surfaces orthogonal to one another, and manufacturing methods do not adequately address this issue.
Innovation Solution
A connector design utilizing a stack of electrically-conductive pillars and a conductive ball to electrically couple contacts on orthogonal surfaces, formed using a wireless solder technique, with pillars made of copper or copper alloys, and a conductive ball made of metal or metal alloy, such as a soldering paste ball, to bond a die's lateral surface to a wafer's upper surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connectors are used to connect contacts on orthogonal surfaces, then manufacturing complexity increases, but electrical coupling efficiency decreases
Solution Approach 1:
The connector is segmented into distinct functional components: a first pillar structure extending from the wafer contact, a second pillar structure extending from the die contact, and a conductive ball joining them. This segmentation allows each component to be optimized for its specific function while simplifying the overall manufacturing process by enabling separate formation and assembly of each element.
Solution Approach 2:
The invention transitions from planar connections to three-dimensional orthogonal connections by using pillars extending vertically from horizontal contact surfaces and a conductive ball bridging them in the third dimension. This dimensional approach enables electrical coupling between contacts on orthogonal surfaces (wafer upper surface and die lateral surface) that cannot be connected by conventional planar connectors.
2Manufacturing precision
If wireless solder technique is used to form pillars, then manufacturing precision improves, but process complexity increases
Solution Approach 1:
The wireless solder technique replaces traditional mechanical wire bonding or manual soldering processes with a contactless induction-based heating method. An induction coil generates an electromagnetic field that induces eddy currents in the conductive material, heating and melting it to form precise pillar structures without mechanical contact, thereby improving precision while the process complexity is managed through automation.
Solution Approach 2:
The wireless solder technique controls pillar formation by adjusting key parameters such as induction coil frequency, power level, and exposure time. By precisely controlling these parameters, the process achieves high manufacturing precision for pillar dimensions and positioning, while the parameter-based control approach allows for programmable automation that manages process complexity.
3Productivity
If multiple separate manufacturing steps are used for connector formation, then manufacturing flexibility increases, but productivity decreases
Solution Approach 1:
The manufacturing process merges multiple operations into an integrated sequence: forming the first pillar on the wafer contact, forming the second pillar on the die contact, positioning the die laterally, and placing the conductive ball to join the pillars. This merged process enables simultaneous or sequential execution of multiple steps in a single manufacturing flow, improving productivity while maintaining the flexibility to adjust individual step parameters.
Solution Approach 2:
The first and second pillars are formed in advance on their respective contacts before the actual connection assembly. This preliminary action allows the pillar structures to be pre-formed with precise dimensions and positions, and then simply joined together with the conductive ball during the connection step, thereby increasing manufacturing throughput by separating formation from assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective electrical coupling of contacts on orthogonal surfaces, improving connectivity and manufacturing efficiency by using a method that can be applied to electronic devices like printed circuit boards and substrate plates.
Implementation Method 1
said first pillar(s) are formed by using a tool adapted to a wireless solder technique; said second pillar(s) are formed by using a tool adapted to the wireless solder technique
Implementation Method 2
at least one electrically-conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s)
Data Source
AI summary
The present disclosure relates to an electronic device comprising a wafer comprising a first upper surface having at least one first contact arranged thereon; and at least one die comprising a second upper surface having at least one second contact arranged thereon, and at least one first lateral surface orthogonal to the second upper surface, said first contact being coupled to said second contact by a connector comprising one first conductive pillar formed on said first contact of said wafer; one second conductive pillar formed on said second contact of said die; and at least one conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s).