Circuit Module Recess Layout to Isolate Solder From Bonding Adhesive
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Solution Overview
Problem
The contact between solder and bonding adhesive in circuit modules can cause malfunctions due to electrical conductivity or adhesive melting, as seen in existing circuit modules where solder and bonding adhesive come into contact during the heating and cooling process.
Innovation Solution
A circuit module design featuring a recessed area in the substrate surface that prevents solder and bonding adhesive from contacting, using a material identical to the substrate surface to contain molten solder and maintain insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is heated and cooled to connect the energy storage member and conductive element, then electrical connection is achieved, but solder may spread and contact the bonding adhesive causing malfunction or melting
Solution Approach 1:
The substrate surface is segmented into a first area and a second area by a first recess. The first recess physically divides the space where solder flows, confining molten solder to the first area during heating and preventing it from reaching the bonding adhesive in the second area. This spatial segmentation resolves the contradiction by maintaining electrical connection functionality while eliminating the harmful contact between solder and bonding adhesive.
Solution Approach 2:
The first recess acts as an intermediary barrier between the solder and the bonding adhesive. By introducing this intermediate structure, the patent prevents direct contact between the two materials. The recess serves as a buffer zone that allows solder to be heated and cooled for electrical connection while simultaneously protecting the bonding adhesive from harmful contact.
2Strength
If bonding adhesive is used to fix the shield layer and semiconductor package body, then structural assembly is achieved, but heated solder may melt the bonding adhesive or cause electrical malfunction through contact
Solution Approach 1:
The substrate surface is divided into distinct functional areas: a first area for solder placement and heating, and a second area for bonding adhesive placement. The first recess creates this segmentation, ensuring that the bonding adhesive remains in a protected zone away from the thermal and mechanical effects of solder heating, thus maintaining both structural strength and circuit reliability.
Solution Approach 2:
The first recess serves as an intermediary protective structure between the solder and bonding adhesive. This intermediate feature allows the bonding adhesive to fulfill its structural assembly function while being shielded from the harmful effects of heated solder, thereby maintaining both structural integrity and electrical reliability.
3Ease of manufacture
If the substrate surface is flat, then manufacturing is simpler, but solder and bonding adhesive cannot be spatially separated to prevent contact
Solution Approach 1:
Instead of maintaining a completely flat two-dimensional substrate surface, the patent introduces a vertical dimension by creating a first recess. This dimensional change allows the substrate to have both a first area and a second area at different vertical levels, enabling spatial separation of solder and bonding adhesive while still using standard substrate manufacturing techniques. The recess provides the necessary three-dimensional configuration to prevent harmful contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents solder and bonding adhesive contact, ensuring reliable electrical connections and maintaining insulation performance by containing molten solder within the recessed area, thus avoiding malfunctions and enhancing creepage distance.
Implementation Method 1
the solder is heated and cooled
Implementation Method 2
the solder is heated and cooled, and thus allows the energy storage member and the conductive element of the semiconductor package body to be electrically connected to each other therethrough
Data Source
AI summary
A circuit module includes a substrate module including an upper main surface with a normal line extending in a vertical direction, an electronic component on the substrate module, and a bonding adhesive fixing the electronic component to the upper main surface. The electronic component includes a first electrode. The substrate module includes a second electrode on the right of the bonding adhesive. The first electrode is electrically connected to the second electrode through solder. A first recess recessed downward and including a bottom is in the upper main surface. An upper end of the second electrode is above the bottom. The first recess includes a first area on the left of a first electrode and overlapping the second electrode when viewed in the lateral direction. A material of the first recess is identical to a material of the upper main surface.