PCB Power Module Connection for Low-Inductance Inverters
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Solution Overview
Problem
Existing circuit arrangements in electric or hybrid vehicles face challenges in reducing commutation inductance and addressing poor heat dissipation from power transistors in inverters, particularly in compact designs with integrated DC link capacitors.
Innovation Solution
A circuit arrangement utilizing a printed circuit board (PCB) or insulated metal substrate (IMS) to connect power modules and capacitors, with multiple metallization layers and alternating connections to minimize inductance and enhance heat dissipation, utilizing copper-ceramic-copper substrates and thick copper technology for low-inductance and high-current capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If busbars are positioned close together to reduce inductance, then commutation inductance is reduced, but the busbars must be laminated or overmolded which increases spacing and reduces heat dissipation efficiency
Solution Approach 1:
The patent introduces a PCB substrate as an intermediary component that replaces traditional busbars for connecting the DC link capacitor to the inverter. This PCB-based electrical connection serves as a mediator that simultaneously achieves low inductance through its inherent structure and effective heat dissipation through its substrate properties, resolving the contradiction between reducing commutation inductance and maintaining heat dissipation efficiency
Solution Approach 2:
The patent replaces the mechanical busbar connection system with an electrical circuit board system. The PCB provides electrical connections through its trace structure rather than through physical busbar contacts, fundamentally substituting the mechanical connection approach with an integrated electrical pathway that inherently achieves both low inductance and effective thermal management
2Force
If DC link capacitor is integrated close to the inverter to reduce inductance, then commutation inductance is reduced, but manufacturing complexity increases significantly
Solution Approach 1:
The PCB substrate serves multiple functions simultaneously: it provides the electrical connection pathway for low inductance, acts as a mechanical support structure for mounting the DC link capacitor, and serves as a thermal management pathway. This multi-functionality eliminates the need for separate specialized components and complex assembly processes, thereby reducing manufacturing complexity while achieving low inductance
Solution Approach 2:
The patent merges the electrical connection function, mechanical support function, and thermal management function into a single PCB substrate. By combining these previously separate functions into one integrated component, the design achieves low inductance through close integration of the DC link capacitor while maintaining ease of manufacture through the use of standard PCB fabrication and assembly processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces commutation inductance and improves heat dissipation, enhancing the performance and efficiency of power modules in inverters.
Implementation Method 1
The capacitor and the power semiconductors are connected to each other via at least one first electrical connection and at least one second electrical connection, which are at least partially formed by a further substrate, which is configured as a printed circuit board (PCB) or an insulated metal substrate (IMS)
Implementation Method 2
The power module is preferably designed as a pulse inverter... The substrate of the power module is preferably configured as a copper-ceramic-copper substrate... The ceramic substrate allows for very efficient power dissipation
Data Source
Figure 1~2
Figure 3~4b
AI summary
The invention relates to a circuit arrangement (1) comprising a power module (3) and at least one capacitor (2), wherein the power module (3) comprises several power transistors on a first substrate, wherein the capacitor (2) and the power semiconductors are connected to each other via at least one first electrical connection and at least one second electrical connection, wherein the electrical connections are formed at least partially by a further substrate, wherein the further substrate is designed as a printed circuit board (5) or as an insulated metal substrate.