Soldering Temperature Distribution Control for Uniform Solder Flow
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Solution Overview
Problem
Existing soldering systems face issues with uneven solder distribution due to accumulating oxidized lumps (dross) in the solder bath, leading to defective soldering, as they rely solely on manual adjustment of the former's location without considering temperature and flow adjustments.
Innovation Solution
Incorporating temperature measurement means and driving means to measure and adjust the temperature distribution of the solder workpiece, allowing for precise control of soldering conditions such as former angle, nozzle plate angle, conveyance speed, solder temperature, and flow amount to ensure uniform solder distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual adjustment of the former's location is used, then the soldering system can operate with simple structure, but the soldering precision deteriorates due to uneven solder distribution caused by oxidized lumps
Solution Approach 1:
The patent implements a feedback control system where a camera captures images of the solder bath surface, detects the location of oxidized lumps (dross), and automatically adjusts the former's position to avoid areas with accumulated dross. This closed-loop feedback mechanism maintains soldering precision without requiring manual intervention.
Solution Approach 2:
The system performs self-adjustment by automatically detecting dross accumulation and repositioning the former accordingly. The soldering system monitors its own operating conditions and makes corrective adjustments without external intervention, maintaining consistent soldering quality over time.
2Manufacturing precision
If only the location of the former is adjusted, then the adjustment process is simple, but the soldering quality deteriorates because temperature and flow conditions are not optimized
Solution Approach 1:
The patent extends adjustment beyond merely the former's location to include multiple parameters: solder bath temperature, solder flow rate, and former position. By simultaneously optimizing these parameters based on detected dross conditions, the system achieves comprehensive soldering quality control.
Solution Approach 2:
The system dynamically adjusts multiple parameters in response to real-time conditions. Rather than fixed settings, the solder temperature, flow rate, and former position are continuously optimized based on the detected state of the solder bath, enabling adaptive quality control.
3Productivity
If the former position is manually adjusted based on visual observation, then the system requires less automation, but the productivity deteriorates due to reliance on experienced workers and manual intervention
Solution Approach 1:
The patent replaces manual visual observation and mechanical adjustment with an automated optical detection and control system. A camera and image processing system substitute for human eyes and judgment, while automated actuators replace manual positioning, significantly improving productivity.
Solution Approach 2:
The system performs self-monitoring and self-adjustment without requiring operator intervention. The automated detection and control system maintains optimal soldering conditions continuously, eliminating downtime for manual adjustments and maximizing production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables more appropriate and uniform soldering by adjusting control parameters to maintain a target temperature distribution, reducing defective soldering occurrences and improving soldering quality.
Implementation Method 1
temperature measurement means for measuring a temperature distribution of a surface of the solder workpiece
Implementation Method 2
The location of the oxidized lumps in the solder bath changes from moment to moment due to convection
Data Source
AI summary
A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.