Bent Lead Plate Soldering Structure to Stop Solder Flow-Down
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing circuit board soldering structures face issues with molten solder flowing down from gaps, causing heat damage and short-circuiting, due to inadequate maintenance of molten solder temperature for alloy layer formation.
Innovation Solution
A circuit board soldering structure with a bent lead plate that narrows the gap between the lead plate and slit hole, and includes a placement section to ensure accurate positioning, preventing molten solder from flowing down, utilizing a bent section to ensure accurate positioning and a bent section to prevent the adverse effect of molten solder from flowing down, utilizing a placement section to ensure accurate positioning, and a bent section to prevent the adverse effect of molten solder from flowing down.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the lead plate is inserted into the slit hole to achieve soldering, then the contact area between the lead plate and conductive pattern is increased, but the molten solder flows down from the gap causing heat damage and short-circuiting
Solution Approach 1:
The lead plate includes a bent section that curves toward the inner surface of the slit hole, narrowing the gap between them. This curvature allows the lead plate to maintain close contact with the slit hole wall, preventing molten solder from flowing down the gap while preserving the large contact area needed for reliable soldering.
Solution Approach 2:
The bent section of the lead plate is pre-formed to counteract the natural tendency of molten solder to flow down the gap. By positioning the lead plate to narrow the gap before soldering occurs, the structure proactively prevents the harmful flow of solder that would cause heat damage and short-circuiting.
2Ease of operation
If the gap between the lead plate and inner surface of the slit hole is maintained, then the lead plate can be inserted easily, but the molten solder flows down causing adverse effects
Solution Approach 1:
The bent section creates a curved interface between the lead plate and slit hole that narrows the gap. This curvature maintains ease of insertion while preventing the gap from being wide enough to allow molten solder to flow down and cause adverse effects.
3Reliability
If the molten solder is maintained at high temperature for alloy layer formation, then reliable soldering is achieved, but the solder becomes more fluid and flows down from the gap
Solution Approach 1:
The bent section narrows the gap between the lead plate and slit hole, creating a restricted pathway that prevents molten solder from flowing down even when maintained at high temperature for alloy layer formation. This allows reliable soldering to be achieved without the harmful effect of solder flow.
Solution Approach 2:
The bent section acts as an intermediary structure between the lead plate and the molten solder, physically blocking the solder from flowing down the gap while allowing the necessary thermal and metallurgical processes to occur for reliable soldering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure reliably prevents molten solder from flowing down, ensuring stable and reliable soldering by maintaining the molten solder at a high temperature for alloy layer formation, reducing manufacturing costs and enhancing electrical connection stability.
Implementation Method 1
The bent section is configured to narrow a gap between the lead plate and an inner surface of the slit hole
Implementation Method 2
the molten solder having flown into the gap to heat both the surfaces of the lead plate and the metal film to a predetermined temperature
Implementation Method 3
soldering forms an alloy layer at an interface between solder and metal and strongly joins the solder to the metal
Data Source
Figure 1
Figure 2
Figure 3
AI summary
An adverse effect of molten solder flowing down is prevented while a circuit board is reliably and stably connected to a lead plate. A circuit board soldering structure includes lead a plate (2) inserted into a slit hole (30) of a circuit board (3) and soldered to a conductive pattern (31) provided along the slit hole (30). The lead plate (2) is made of an elastically-deformable metal plate thinner than an opening width (W) of slit hole (30). The lead plate (2) includes insertion section (20) inserted into the slit hole (30). The insertion section (20) includes a bent section (21) approaching from one of opposing inner surfaces (32) of the slit hole (30) facing each other toward another of the opposing inner surfaces 32 of the slit hole (30). The bent section (21) is disposed in the slit hole (30). The insertion section (20) has both surfaces that are close to or contact corresponding opposing inner surfaces (32) of the slit hole (30) to solder the insertion section (20) to the conductive pattern (31).