Antenna Package with TIV Walls to Reduce RF Coupling
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Solution Overview
Problem
Current CMOS RF chip implementations, particularly using LTCC substrates, face challenges with large area requirements and unwanted electromagnetic and substrate coupling, which interfere with performance, especially at high frequencies like those needed for 5G and car radar applications.
Innovation Solution
The design incorporates an insulating substrate antenna package with vertical through interposer via walls (TIV-walls) and TIV-gratings to form antenna regions, utilizing a low dielectric constant molding compound layer and various materials like polyimide, which reduces coupling effects and enables efficient lateral RF signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If LTCC substrate is used for integrating mm-wave antennas with RF ICs, then integration is achieved, but area becomes excessively large and unwanted electromagnetic coupling occurs
Solution Approach 1:
The patent transitions from planar antenna designs to three-dimensional vertically embedded folded monopole antennas integrated into LTCC substrate carriers. This dimensional change allows the antenna to utilize the vertical space within the substrate, achieving compact integration while maintaining mm-wave performance without requiring excessive lateral area.
2Adaptability or versatility
If LTCC substrate is used for integrating mm-wave antennas with RF ICs, then integration is achieved, but unwanted electromagnetic coupling interferes with performance
Solution Approach 1:
The patent extracts and separates the antenna structure from the RF IC components, integrating the vertically embedded folded monopole antenna into the LTCC substrate carrier while maintaining physical and electromagnetic separation from the RF IC. This extraction approach enables integration benefits while minimizing unwanted electromagnetic coupling between antenna and RF IC components.
3Adaptability or versatility
If vertically embedded folded monopole antenna is integrated into LTCC substrate, then compact integration is achieved, but area becomes excessively large
Solution Approach 1:
The patent implements nesting by embedding the folded monopole antenna structure within the LTCC substrate carrier layers. The antenna elements are nested between substrate layers, with feed structures and matching networks integrated within the same substrate volume, achieving compact three-dimensional integration that minimizes the overall footprint area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved performance, smaller area usage, and higher integration, making it suitable for high-frequency applications such as 5G and car radar, with enhanced RF signal transmission and reduced noise interference.
Implementation Method 1
utilizing a low dielectric constant molding compound layer
Data Source
AI summary
This application relates to a device for signal transmission (e.g., radio frequency transmission) and a method for forming the device. For example, the method includes: depositing an insulating layer that includes polybenzobisoxazole (PBO) on a carrier; forming a backside layer including polyimide (PI) over the adhesive layer; forming a die-attach film (DAF) over the backside layer; forming one or more through-insulator via (TIV)-wall structures and one or more TIV-grating structures on the second backside layer; placing a die, such as a radio frequency (RF) integrated circuit (IC) die, on the DAF; encapsulating the die, the one or more TIV-wall structures, and the one or more TIV-grating structures, with a molding compound to form an antenna package including one or more antenna regions; and forming a redistribution layer (RDL) structure on the encapsulated package. The RDL structure can include one or more antenna structures coupled to the die. Each of the one or more antenna structures can be positioned over the one or more antenna regions.