Antenna Arrays TRIZ Cases

Buried chips and dual-surface antenna patterns shorten signal paths, cut shadow regions, and improve mm-wave radiation in compact modules.

Using longer CPW paths with shorter microstrip lines preserves phase matching while reducing feed board crowding, coupling, and insertion loss.

Segmented shielding fences around antenna conductive patterns cut EMI while preserving signal transmission and package integration.

Voltage-tuned dielectric resonators between metallic pillars enable dynamic phase and amplitude control for beam steering across a 2D metasurface.

Combining CW and FMCW radar with a non-uniform antenna array improves long-range golf ball speed, spin, and carry measurement in real time.

Multiple radiators on an intermediate circuit board expand display antenna coverage and frequency bands while reducing high-frequency signal loss.

Coded electromagnetic signals and echo correlation improve close-range distance and motion sensing by avoiding switch delays and reducing leakage.

Distinct pulse polarizations and phase shifts separate short- and long-range radar echoes, reducing spurious returns without losing compression gain.

A three-metal-layer PCB antenna uses an intermediate coupler to widen impedance bandwidth, improve efficiency, and support large scan angles.

Millimeter-wave radar inside a downlight detects presence and movement direction to count entries and exits without cameras or extra sensors.

A thermal plate with embedded passive two-phase flow devices moves heat from radiating modules and beamforming boards while keeping the DRA compact.

Shared ground through-holes let RF signal vias be packed more tightly while preserving impedance matching and reducing transmission loss.

A spherical phased array keeps beam width and antenna gain stable during electronic weather scanning, improving target tracking accuracy.

Driven and parasitic patches enable one antenna array to cover 78 and 94 GHz while simplifying fabrication with laser writing and extrusion plating.

Grounded high-impedance members cool parasitic radiator elements in mmWave antenna packages while reducing warpage and delamination.

A four-layer PCB routes high-frequency signals to antennas on the opposite side, improving process separation, shielding, and compact radar layout.

A two-step phase code optimization process cuts MIMO radar scheduling complexity while improving code orthogonality and angular resolution.

Voltage-tuned liquid crystal phase shifting enables compact phased-array beam steering with higher gain, precise tracking, and lower power use.

Spring tabs and intermediate fins secure RF antenna portions within a heatsink, improving thermal dissipation and antenna efficiency in compact devices.

A conductive pattern tied to a parasitic element supports and aligns the dielectric member while widening antenna band and avoiding extra fixing lands.

Independent AESA subarrays form simultaneous beams for continuous ground clutter suppression while supporting weather and wind shear radar functions.

A dual-arm antenna mount uses localized compliance and asymmetric stiffness to relieve thermal mismatch stress while limiting twisting deflection.

A cavity-backed planar aperture antenna suppresses rearward mmWave radiation to cut polarization loss in slim terminal structures.

A tetrahedral plate layout enables one phased array antenna to deliver 360° transmit and receive coverage with lower size, weight, and interference.

Placing the electronic component between the antenna and ground layers improves coupling, cuts signal loss, and supports thinner wireless packages.

Varying emitter pitch on flat and foldable substrate regions improves light distribution and operation quality across lateral and back surfaces.

Heat spreaders and a heat sink route IC and speaker heat to the housing, keeping compact mesh devices within safe thermal limits.

Optically tunable antenna patches and switch control adjust reflectivity to vary geometric phase and improve diffraction efficiency.

A four-substrate liquid crystal antenna uses frame glue and outer connection structures to simplify preparation and protect microstrip arrays.

EBG structures and cavity-backed antennas let a radar MMIC package cut size, power use, mutual coupling, and spurious radiation.

Processor-controlled LNA switching and nonmetallic antenna isolation reduce folded-state RSE while preserving reception sensitivity.

Variable coupling-line impedance lets terahertz active antennas control phase differences for arbitrary beam steering and synchronized operation.

Vertical TIV walls and gratings in an insulating antenna package cut electromagnetic coupling, shrink substrate area, and improve RF transmission.

Mounting a 10+ GHz conformal antenna on non-metallic vehicle parts cuts housing bulk while preserving signal transfer and thermal control.

A dual-antenna package routes mmWave beams through glass and frame, enabling bezel-less displays without blocking radar sensing.

Dynamic impedance switching grounds antenna-induced power near the camera module, preserving stable camera-processor communication in 5G devices.

Asymmetric doping and gate-voltage tuning improve THz detection sensitivity while enabling resonant frequency control and polarization sensing.

Driven and parasitic elements around a central axis shrink omnidirectional CP antennas while preserving circular propagation and gain.

Shared-port antenna routing creates shifted phase centers for virtual MIMO arrays, improving automotive radar angle accuracy with less hardware.

Dual end-fire and patch antennas steer mmWave beams through glass and frame, preserving bezel-less display area for gesture sensing.

Phase-shifted antenna arrays combine direct satellite signals and cancel reflections or fake sources to improve positioning precision.

Zigzag corrugated fins raise heat-transfer area in a compact antenna cooling channel without thinner fins, reducing thermal resistance and leakage.

A wide-slot coplanar antenna with a surrounding scattering element broadens azimuth beamwidth for windshield-integrated V2X links.

Embedding a double-sided TRC die in the package substrate shortens RF paths, cutting power loss and improving range in compact assemblies.

Varactor-tuned c-shaped copper patches steer antenna beams through lookup-table capacitance mapping, cutting phased-array complexity and cost.

Vertical TSV routing links the RF chip to a rear-side antenna through an RDL stack, cutting AiP routing loss for high-frequency communication.

An annular slot and inverted-F antenna layout supports multiple frequency bands in less terminal space while maintaining radiation performance.

Direct plating replaces solder bonding to cut signal loss while an integrated heat dissipation structure keeps the antenna module compact.

A sinusoidal folded waveguide uses radiation slot spacing and size control to suppress grating and X-band lobes for precise antenna patterns.

Placing the patch and common electrode on one substrate side cuts dielectric loss and lowers crack risk in liquid-crystal antenna structures.