Integrated Antenna Module Layout for Compact Signal Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing methods for wireless communication devices with integrated antennas and communication modules result in separate manufacturing costs and difficulty in achieving a compact design due to the separate manufacturing and electrical connection of these components, which can lead to increased device thickness and hinder miniaturization.
Innovation Solution
The proposed solution involves an antenna module with an antenna layer, a ground layer, and an electronic component, where the ground layer is disposed over the antenna layer, and the electronic component is positioned between them, creating a coupling space to enhance signal transmission and reduce signal loss without increasing the device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the antenna and communication module are separately manufactured and electrically connected on the circuit board, then each component can be manufactured independently with standard processes, but the device size increases and manufacturing costs increase due to separate production
Solution Approach 1:
The patent merges the antenna and communication module into a single integrated antenna module structure. The communication module is positioned between the antenna layer and ground layer, creating a compact integrated unit that eliminates the need for separate manufacturing and assembly of discrete components on the circuit board, thereby reducing overall device size while maintaining manufacturability
2Adaptability or versatility
If the antenna and communication module are separately manufactured and connected, then manufacturing flexibility is maintained, but separate manufacturing costs are incurred for both components
Solution Approach 1:
By integrating the communication module within the antenna module structure, the patent enables single-unit manufacturing that eliminates duplicate manufacturing costs. The integrated design allows both components to be produced together in one process flow, reducing overall manufacturing cost while maintaining flexibility through modular design that can be adapted to different applications
3Reliability
If the electronic component is positioned between the antenna layer and ground layer, then signal coupling is optimized and signal loss is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent positions the communication module in the vertical dimension between the antenna layer and ground layer, creating a three-dimensional integrated structure. This spatial arrangement optimizes signal coupling by placing the electronic component in close proximity to both layers, improving signal transmission quality while the layer-based fabrication process manages manufacturing complexity through standardized sequential deposition techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves antenna gain by reducing signal loss and allows for miniaturization of the semiconductor device package without increasing its thickness, as the electronic component is closer to the ground layer than the antenna, optimizing signal coupling and performance.
Implementation Method 1
The ground layer and the antenna layer defines a coupling space. The electronic component is disposed within the coupling space.
Data Source
AI summary
The present disclosure provides an antenna module. The antenna module includes an antenna layer, a ground layer, and an electronic component. The ground layer is disposed over the antenna layer. The electronic component is disposed between the antenna layer and the ground layer.