DRA Antenna Thermal Plate Layout for Compact Heat Management

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Solution Overview

Problem

Direct radiating array (DRA) antennas for satellite communications face challenges in managing size, mass, and power, particularly in Low Earth Orbit (LEO) applications, where mechanical and electrical components must be closely packed to maintain efficiency, and heat management is critical due to the proximity of power converters and signal amplifiers, leading to increased weight and reduced space for electrical equipment.

Innovation Solution

A DRA antenna assembly with a thermal plate incorporating passive two-phase flow devices, such as heat pipes, to efficiently manage heat generated by dissipative components, and a modular design that integrates radiating elements, filters, amplifier units, and digital beamforming boards to reduce size, mass, and power consumption, while allowing for effective thermal management and structural support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If mechanical and electrical components are concentrated in close proximity to the array to reduce signal losses, then signal transmission efficiency is improved, but heat management becomes more difficult and antenna weight increases

Engineering Contradiction:
Improvesignal lossVSAvoidheat management
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

The patent positions digital beamforming boards on the backside of the radiating array, utilizing the z-dimension (depth) rather than concentrating all components in the same plane. This spatial arrangement reduces signal path length while separating heat-generating components from the radiating elements, improving both signal efficiency and thermal management.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The antenna system is divided into modular radiating element assemblies, each with its own integrated components. This segmentation allows distributed heat management and reduces the concentration of thermal loads in any single location, while maintaining short signal paths within each module.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the number of radiating elements is increased to improve antenna efficiency, then electrical performance is improved, but antenna weight increases

Engineering Contradiction:
Improveantenna efficiencyVSAvoidantenna weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

Multiple functions (radiating element, filter, amplifier, digital beamforming board) are merged into integrated assemblies mounted on a common backside structure. This consolidation reduces the total number of separate components and mounting structures needed, decreasing overall weight while maintaining high element counts for improved efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The backside mounting structure serves multiple functions: structural support for digital beamforming boards, thermal management surface, and signal routing substrate. This multi-functionality eliminates the need for separate components for each function, reducing total weight while supporting numerous radiating elements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Weight of moving object

If physical volume of structural aspects is reduced to decrease antenna weight, then weight is reduced, but available space for electrical equipment is reduced

Engineering Contradiction:
Improveantenna weightVSAvoidspace for electrical equipment
Core Design Contradiction:
Weight of moving objectVSAdaptability or versatility

Solution Approach 1:

Electrical equipment (digital beamforming boards) is mounted on the backside of the radiating array, utilizing the z-dimension rather than competing for space in the radiating plane. This arrangement provides adequate space for electrical equipment while maintaining a compact overall structure with reduced weight.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a compact, low-mass, and modular antenna assembly that maintains component temperatures within acceptable ranges, reduces signal losses, and optimizes space usage, enhancing the electrical performance and thermal management of DRA antennas in spaceborne applications.

Implementation Method 1

a thermal plate having a plurality of passive two-phase flow devices embedded therein for transporting heat received from the dissipative components away from an interior of the DRA assembly

Methodology Applied
Scientific EffectTwo-phase flow: Two-Phase Flow

Implementation Method 2

The thermal plate may include a plurality of passive two-phase flow devices embedded in or mounted on the support plate

Methodology Applied
Scientific EffectHeat transport: Heat Pipe

Data Source

PatentUS20240006778A1Direct radiating array ("DRA") antenna, method of assembling a DRA antenna, and system for managing heat generated by a DRA antenna
Publication Date: 2024.01.04 MACDONALD DETTWILER & ASSOC INC
  • US20240006778A1 patent drawing
  • US20240006778A1 patent drawing
  • US20240006778A1 patent drawing

AI summary

Direct radiating array (“DRA”) antenna assemblies, methods of assembling a DRA antenna assembly, and systems for managing heat generated by a DRA antenna assembly are provided. A DRA antenna assembly includes: multiple radiating element modules, each radiating element module including a first dissipative component; multiple digital beamforming boards, each digital beamforming board having a radio frequency (“RF”) connection to and servicing a subset of the radiating element modules and including a second dissipative component; and a thermal plate having a top surface and a bottom surface, the radiating elements and the digital boards mounted to the top surface and the bottom surface, respectively, such that the first and second dissipative components are heat sunk to the thermal plate. The thermal plate includes a plurality of passive two-phase flow devices embedded therein for transporting heat received from the first and second dissipative components away from an interior of the DRA assembly.