Embedded TRC Die Assembly for Shorter RF Routing Paths
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Solution Overview
Problem
Conventional microelectronic assemblies face challenges in achieving high-performance wireless transmission and reception due to increased power loss and reduced communication range caused by long routing lines between RF dies and antennas, leading to thermal and size constraints in IC packages.
Innovation Solution
A microelectronic assembly with a double-sided transmitter/receiver chain (TRC) die embedded within the package substrate, where the TRC die has conductive contacts on both surfaces electrically coupled to the transmitter/receiver logic (TRL) die and antenna elements via conductive pathways, minimizing routing line length and optimizing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional substrates with long routing lines are used, then RF signal transmission is achieved, but power loss increases and communication range decreases
Solution Approach 1:
The patent embeds the TRC die within the package substrate, transitioning from a planar surface mounting arrangement to a three-dimensional embedded structure. This vertical integration reduces the horizontal routing distance between the TRC die and antenna elements, thereby reducing power loss in the RF signal path while maintaining compact package dimensions.
Solution Approach 2:
The TRC die is embedded within cavities formed in the package substrate, creating a nested structure where the die is housed inside the substrate volume. This nesting approach minimizes the distance between the TRC die and antenna elements while optimizing thermal management and signal integrity.
2Temperature
If RF dies are placed on package substrate, then data transfer is enabled, but thermal management becomes constrained
Solution Approach 1:
The TRC die is embedded within cavities in the package substrate, allowing thermal vias to be integrated around and beneath the die. This nested structure provides direct thermal pathways from the RF die to the substrate and ultimately to external heat sinks, improving heat dissipation while maintaining a compact package form factor.
Solution Approach 2:
The package substrate acts as an intermediary thermal management structure, with thermal vias serving as conductive pathways between the RF die and external heat dissipation structures. This mediator approach enables efficient heat transfer without requiring direct contact between the RF die and external cooling mechanisms.
3Loss of energy
If routing line length is reduced, then power loss decreases, but manufacturing precision requirements increase
Solution Approach 1:
Cavities for embedding the TRC die are formed in the package substrate before the die is placed and interconnected. This preliminary cavity formation allows for precise positioning and alignment of the TRC die, reducing the manufacturing precision challenges that would arise from attempting to align and connect components after substrate fabrication.
Solution Approach 2:
Conductive pathways and interconnect structures are formed as intermediary elements between the TRC die and antenna elements. These pre-formed conductive structures facilitate precise electrical connection while accommodating minor variations in die placement, thereby reducing the overall manufacturing precision requirements.
Data Source
AI summary
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a transmitter/receiver logic (TRL) die coupled to the first surface of the package substrate; a plurality of antenna elements adjacent the second surface of the package substrate; and a transmitter/receiver chain (TRC) die, wherein the TRC die is embedded in the package substrate, and wherein the TRC die is electrically coupled to the RF die and at least one of the plurality of antenna elements via conductive pathways in the package substrate. In some embodiments, a microelectronic assembly may further include a double-sided TRC die. In some embodiments, a microelectronic assembly may further include a TRC die having an amplifier. In some embodiments, a microelectronic assembly may further include a TRL die having a modem and a phase shifter.