Anti-Break Buffer Sheets for Circuit Board Edge Protection
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Solution Overview
Problem
Circuit board edges, especially sharp corners, prone to cutting or squeezing connected electronic wires or heating materials under dynamic stress in wearable heating clothing, leading to physical damage and potential safety hazards, despite the use of high-cost materials and complex processes.
Innovation Solution
An anti-break structure involving thin buffer sheets made of EDF materials like PI or polyester films, with a thickness less than 0.1 mm, are connected to circuit board edges to prevent cuts and breaks by forming an extended carrying and buffer protection portion between the edges and electronic wires, effectively isolating them from stress impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high-cost wear-resistant materials and complex processes are used to improve circuit board edge durability, then material strength and wear resistance are improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent introduces a buffer sheet as an intermediary protective layer between the circuit board edge and the electronic wires/heating materials. This buffer sheet absorbs the mechanical stress and prevents direct contact between sharp board edges and connected components, solving the durability problem without requiring expensive specialized materials or complex manufacturing processes for the circuit board itself.
Solution Approach 2:
The protection system is segmented into separate functional components: the circuit board body and the detachable buffer sheet. This allows the buffer sheet to be optimized specifically for edge protection functionality while keeping the circuit board manufacturing simple and cost-effective. The buffer sheet can be independently selected and replaced without affecting the circuit board structure.
2Reliability
If complex processes and high-cost materials are adopted to prevent edge damage, then protection effectiveness is improved, but device complexity increases
Solution Approach 1:
The buffer sheet serves as a simple intermediary element that provides reliable protection through its physical presence between the circuit board edge and connected components. Its simplicity in structure (a single protective layer) contrasts with the complex multi-step processes and specialized materials that would otherwise be needed to achieve the same level of protection integration into the circuit board itself.
Solution Approach 2:
The buffer sheet is implemented as a thin film or flexible protective layer that conforms to the circuit board edge geometry. This thin-film approach provides effective protection while adding minimal structural complexity and maintaining flexibility in the overall assembly, avoiding rigid complex protective structures.
3Strength
If buffer sheets with greater thickness are used to enhance protection, then buffering capability is improved, but the buffer sheet may interfere with wiring space and increase overall dimensions
Solution Approach 1:
The buffer sheet is designed as a thin film with thickness less than 0.1 mm, providing effective buffering capability while occupying minimal space. This thin-film construction ensures adequate protection against edge-related damage without significantly increasing the overall dimensions or interfering with the wiring space required for electronic wire routing and heating material placement.
Solution Approach 2:
The buffer sheet provides localized protection precisely where needed at the circuit board edges and corners, rather than uniformly thick protection across the entire board. This localized approach maximizes buffering capability at critical stress points while minimizing the overall material usage and space occupation, preserving wiring space in non-critical areas.
Data Source
AI summary
The present invention discloses an anti-break structure for setting buffer sheets at circuit board edges; the setting of polyimide (PI) or polyester films with a thickness less than 0.1 mm at PCB, copper foil circuit board or FPC board edges can help to achieve an effective isolation between electronic wires and circuit board edge corners. This structure can not only achieve protection under static conditions, but also significantly reduce potential cuts and breaks of electronic wires or heating materials under dynamic stress conditions such as washing, twisting and bending processes of wearable heating clothing. Compared with those high-cost solutions in the prior art that use more wear-resistant materials or complex processes, the present invention solves the problem of damage to connecting components at circuit board edges in a more economical manner, improving the durability and safety of equipment.