Circuit Bendability/Stretchability TRIZ Cases
- Flexible Substrate Package Carrier with Chip Accommodating Cavity
A flexible substrate package carrier forms a chip accommodating cavity using build-up structures to increase disposition space.
- Curved Imaging Arrays via Stretchable Interconnections
Transfer print CMOS imagers on pre-strained elastomeric stamps to create reliable curved imaging arrays with reduced distortion.
- Stretchable Electronics Wire Routing via Strain Database
A layout database maps strain distribution to wire routing parameters for conductive wires on flexible objects.
- Twistable Light Source Support for Curved Automotive Surfaces
A twistable light source support joins rigid segments via a flexible arm to conform to curved automotive surfaces.
- Wire Layer Coarse Structure for Flexible Substrate Peeling
Localizing surface roughness on a wire layer resolves stiffness contradictions during flexible substrate peeling, preventing damage to rigid elements.