Wire Layer Coarse Structure for Flexible Substrate Peeling
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Solution Overview
Problem
The challenge in fabricating electronic elements on flexible substrates is that the stiffness of the overall device is not uniform, leading to the need for varying peel forces during mechanical stripping, which can cause damage and reduce production yield.
Innovation Solution
A method involving a wire layer with a coarse structure on one surface and a rigid element on the other, where the stiffness of the rigid element is greater than the wire layer, and a release layer is used between the flexible substrate and a carrier, with a laser beam irradiating the release layer to reduce adhesion and facilitate uniform peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a release layer with low adhesion is used to facilitate easy stripping, then the peel force required is reduced, but the stiffness uniformity deteriorates due to rigid elements requiring greater peel force
Solution Approach 1:
The patent applies local quality by creating different surface roughness regions on the flexible substrate. The first region (with rigid elements) has greater surface roughness to increase adhesion and withstand higher peel forces, while the second region has lower surface roughness for easier stripping. This localized differentiation resolves the contradiction between easy stripping and stiffness uniformity.
2Ease of manufacture
If mechanical stripping with uniform peel force is applied, then the process is simple, but damage occurs in areas with greater stiffness requiring higher peel force
Solution Approach 1:
The patent modifies the surface roughness locally in different regions of the flexible substrate. The region with rigid elements has increased surface roughness to provide stronger adhesion, allowing that area to withstand higher peel forces during stripping without damage. This enables uniform mechanical stripping to be applied across the entire substrate without causing damage to stiffness-sensitive areas, thereby maintaining both process simplicity and production yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the successful separation of the flexible substrate from the carrier with a reduced peel force, minimizing damage and improving production yield by ensuring uniform stiffness and reduced adhesion in areas with rigid elements.
Implementation Method 1
a laser beam irradiating the release layer to reduce adhesion and facilitate uniform peeling
Data Source
AI summary
According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.