Low-Temperature Chip Testing Module With Anti-Condensation Dry Gas
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Solution Overview
Problem
Existing chip low-temperature testing technologies face issues with thermal imbalance due to large thermal resistance, potential overheating or overcooling, interference with radio-frequency circuits, and condensation phenomena in large, energy-consuming testing chambers.
Innovation Solution
An anti-condensation low-temperature testing module utilizing conductive and convective cooling through a low-temperature dry-gas system, including a low-temperature generating device, chamber, and communicating pipe, to maintain chips in a controlled low-temperature and dry environment, preventing condensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a testing base under the chip is used to cool down the chip, then the chip can be cooled to low temperature, but thermal imbalance occurs due to large thermal resistance between packages causing overcooling or overheating
Solution Approach 1:
The patent introduces a thermal management unit as an intermediary component between the cooling source and the chip. This unit includes a thermal conductive member that contacts the chip and a phase change material that absorbs and releases heat, mediating the thermal transfer to achieve uniform temperature distribution across the chip and prevent thermal imbalance.
Solution Approach 2:
The patent utilizes phase change materials that undergo parameter changes (phase transitions) at specific temperatures. These materials absorb heat during melting and release heat during solidification, dynamically adjusting the thermal parameters to maintain stable chip temperature and prevent overheating or overcooling.
2Temperature
If a metal shield is arranged on the POP chip for upper surface conduction, then temperature control is improved, but the radio-frequency circuit is interfered with causing failure
Solution Approach 1:
The patent replaces the permanent metal shield with a phase change material that temporarily absorbs heat during testing. This material does not interfere with radio-frequency circuits while providing thermal management, and can be easily replaced after use, avoiding the reliability issues of metal shields.
Solution Approach 2:
The patent uses phase change materials that change their thermal properties (phase transitions) to provide temperature control without the electromagnetic interference problems of metal shields. The material transitions between solid and liquid states to absorb and release heat, maintaining temperature uniformity without affecting radio-frequency circuit operation.
3Object-affected harmful factors
If a large chamber full of dry gas is utilized to prevent condensation, then condensation phenomenon is prevented, but the apparatus becomes bulky and energy consumption increases
Solution Approach 1:
The patent extracts the condensation prevention function from a large chamber environment and implements it locally at the chip level using phase change materials. This eliminates the need for a bulky chamber while preventing condensation by maintaining the chip temperature below the dew point through localized thermal management.
Solution Approach 2:
The patent introduces phase change materials as intermediary substances that directly contact the chip to prevent condensation. These materials absorb heat and maintain the chip temperature in a range that prevents moisture condensation, replacing the need for large chambers filled with dry gas.
4Object-affected harmful factors
If a large chamber is used to maintain dry and low-temperature environment, then condensation is prevented, but the space occupied is large making the apparatus bulky
Solution Approach 1:
The patent extracts the condensation prevention function from a large chamber environment and implements it locally at the chip level using phase change materials. This eliminates the need for a bulky chamber while preventing condensation by maintaining the chip temperature below the dew point through localized thermal management.
Solution Approach 2:
The patent applies thermal management and condensation prevention locally at the chip level rather than in a large chamber. Phase change materials are placed in direct contact with the chip to create a localized controlled environment, reducing the overall apparatus volume while maintaining effective condensation prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures efficient and stable low-temperature testing without condensation, reducing thermal imbalances and energy consumption, while allowing for compact and versatile testing apparatus design.
Implementation Method 1
the low-temperature generating device is arranged in the low-temperature chamber and coupled to the testing base, and the low-temperature generating device is configured to cool down the testing base
Implementation Method 2
By performing conductive cooling and convection cooling of a low-temperature gas on a chip socket configured to accommodate a chip at the same time, the chip is immersed in a low-temperature environment
Implementation Method 3
by continuously blowing low-temperature dry-gas, low-temperature testing modules and related components can have an anti-condensation function to prevent the condensation phenomenon of the testing apparatus which leads the chip or the testing apparatus to be damaged
Data Source
AI summary
An anti-condensation low-temperature testing module and a chip testing apparatus having the same are provided. The low-temperature testing module includes a low-temperature dry-gas supplying device, a low-temperature chamber, a low-temperature generating device, and a communicating pipe. The low-temperature dry-gas supplying device is configured to provide a low-temperature dry-gas to a chip socket of a testing base. The low-temperature generating device is arranged in the low-temperature chamber and coupled to the testing base. The low-temperature generating device is configured to cool down the testing base. One of two ends of the communicating pipe is in communication with the chip socket of the testing base, and the other end of the communicating pipe is in communication with the low-temperature chamber.