Antiparallel Diode Temperature Transducer for Reduced Pad Count
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Solution Overview
Problem
Existing integrated electronic devices with temperature transducers require three pads, leading to increased area consumption and assembly costs, and are inefficient in detecting temperature gradients for timely protection of semiconductor devices.
Innovation Solution
An integrated electronic device with a temperature transducer comprising two diodes connected in antiparallel between two pads, utilizing a control module with an analog-to-digital converter to estimate temperature gradients by generating a digital signal from voltage differences across the diodes, allowing for reduced pad count and area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If three pads are used for the temperature transducer, then temperature gradient detection capability is improved, but area consumption and assembly costs increase
Solution Approach 1:
The patent combines the functions of three separate pads into two pads by electrically connecting the first anode region and second anode region together to form a common anode connection. This merging allows the temperature transducer to maintain its temperature gradient detection capability while reducing the number of external pads from three to two, thereby reducing area consumption and assembly complexity
2Measurement precision
If three pads are used for the temperature transducer, then temperature gradient detection capability is improved, but assembly costs increase
Solution Approach 1:
The patent merges the three-pad configuration into a two-pad configuration by combining the anode connections. This reduction in pad count directly decreases assembly costs by reducing the number of external connections required, while preserving the temperature gradient detection function through the integrated diode structure
3Area of stationary object
If first anode region and second anode region are electrically connected, then pad count is reduced, but device structure becomes more integrated
Solution Approach 1:
The patent merges the first anode region and second anode region into a single electrical connection, reducing the external pad count from three to two. This integration simplifies the overall device structure and reduces area consumption, while the internal diode connections maintain the temperature gradient detection capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient detection of temperature gradients, reducing manufacturing and assembly costs while allowing for timely protection of electronic components by using only two pads and providing diagnostic monitoring capabilities.
Implementation Method 1
each of the first and second voltages VF1, VF2 decreases by approximately 2 mV per degree centigrade
Data Source
AI summary
An integrated electronic device including an electronic component and a temperature transducer formed in a first die. The temperature transducer including a first diode and a second diode which are connected in antiparallel.