Antiparallel Light-Absorbing Chips for ESD Protection and Sensing

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Solution Overview

Problem

Existing optoelectronic components lack effective protection against electrostatic discharges (ESD) and require additional external photosensors for light intensity and color adjustment, leading to increased size and complexity.

Innovation Solution

An optoelectronic component with light-emitting and light-absorbing semiconductor chips arranged antiparallel on a carrier, where the light-absorbing chips function as both protection diodes and environmental sensors, allowing for internal light measurement and adjustment of light-emitting chip currents to maintain consistent light output and color.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If light-absorbing semiconductor chips are integrated into the optoelectronic component, then ESD protection and light measurement functions are provided, but device complexity increases

Engineering Contradiction:
ImproveESD protectionVSAvoidcomponent structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The light-absorbing semiconductor chips serve multiple functions simultaneously: they act as ESD protection diodes connected in antiparallel configuration and as photosensors for light intensity and color measurement. This multi-functionality eliminates the need for separate protection diodes and external photosensors, resolving the contradiction by integrating protective and sensing capabilities into existing component structures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If external photosensors are used for light intensity and color adjustment, then light output consistency is maintained, but component size and complexity increase

Engineering Contradiction:
Improvelight intensity measurementVSAvoidcomponent size
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent merges the photosensing function with the existing light-absorbing semiconductor chips that are already part of the optoelectronic component assembly. By combining the measurement function with existing structural elements rather than adding separate external photosensors, the solution maintains precise light intensity and color measurement capabilities while minimizing increases in component size and complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides effective ESD protection and internal light management, reducing component size and complexity by eliminating the need for external photosensors, while ensuring consistent light intensity and color throughout the component's lifetime.

Implementation Method 1

light from each light-emitting semiconductor chip falls on at least one of the light-absorbing semiconductor chips... the light-absorbing semiconductor chips are formed as protection diodes

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS9293629B2Optoelectronic component and method for operating an optoelectronic component
Publication Date: 2016.03.22 OSRAM OLED
  • US9293629B2 patent drawing
  • US9293629B2 patent drawing
  • US9293629B2 patent drawing

AI summary

An optoelectronic component includes a carrier on which at least one first light-emitting semiconductor chip and one first light-absorbing semiconductor chip connected antiparallel to the at least one first light-emitting semiconductor chip, at least one second light-emitting semiconductor chip and one second light-absorbing semiconductor chip connected antiparallel to the at least one second light-emitting semiconductor chip, wherein the semiconductor chips are arranged on the carrier such that light from each light-emitting semiconductor chip falls on at least one of the light-absorbing semiconductor chips not connected to the respective light-emitting semiconductor chip, and the light-absorbing semiconductor chips are formed as protection diodes.