Aperture-Pattern Membrane for Precise Semiconductor Micro-Bump Testing

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Solution Overview

Problem

Conventional semiconductor test methods face challenges in accurately testing micro bumps of stacked semiconductor devices without causing damage or misalignment, particularly due to their small size and susceptibility to deformation during testing.

Innovation Solution

A semiconductor test device with a membrane portion featuring aperture patterns and conductive paths, made of materials with low thermal expansion and elasticity, allows precise contact with micro bumps while minimizing stress and damage, using a holder portion for support and a magnetic force for alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional test methods are used to contact micro bumps, then testing can be performed, but damage to micro bumps occurs due to their small size and susceptibility to deformation

Engineering Contradiction:

Improvetesting reliabilityVSAvoidmicro bump damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent employs a flexible membrane structure with aperture patterns that can elastically deform to contact micro bumps. The membrane includes a first metal thin film portion and a second metal thin film portion with different widths, creating a flexible yet controlled contact surface that adapts to micro bump positions without causing damage through rigid pressing.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent utilizes magnetic force as an external parameter to control the contact between the membrane and micro bumps. By applying magnetic force, the membrane can be attracted to contact micro bumps gently and precisely, allowing testing while minimizing mechanical damage through non-contact force control.

Inventive Principle:

Principle #35Parameter changes

2Measurement precision

If conventional test devices are used, then testing can be performed, but alignment precision is poor due to difficulty in positioning

Engineering Contradiction:

Improvealignment precisionVSAvoidalignment difficulty

Core Design Contradiction:

Measurement precisionVSEase of operation

Solution Approach 1:

The patent replaces manual or mechanical alignment methods with magnetic force-based alignment. The membrane portion is attracted to micro bumps through magnetic force, enabling precise automatic alignment without complex mechanical positioning systems or manual operation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces magnetic force as an intermediary to achieve alignment. The magnetic force acts as a mediator between the test device and micro bumps, enabling precise positioning without direct mechanical contact during the alignment process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If rigid contact structures are used, then structural strength is sufficient, but stress on micro bumps increases causing deformation

Engineering Contradiction:

Improvestructural strengthVSAvoidmicro bump stress

Core Design Contradiction:

StrengthVSStress or pressure

Solution Approach 1:

The patent uses a flexible membrane structure instead of rigid contact elements. The membrane can elastically deform to match the contour of micro bumps, distributing contact stress over a larger area and reducing peak stress that would cause deformation or damage.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The flexible membrane structure inherently provides cushioning before contact occurs. The membrane's elasticity allows it to gradually approach and contact micro bumps, absorbing excess force and preventing sudden high-stress impacts that could deform the micro bumps.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables reliable electrical connection testing of micro bumps without damage, ensuring accurate alignment and reducing defects in semiconductor devices.

Implementation Method 1

made of materials with low thermal expansion and elasticity

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

using a holder portion for support and a magnetic force for alignment

Methodology Applied

Scientific EffectMagnetic force: Magnetic Field

Data Source

PatentUS20250306090A1Semiconductor test device and manufacturing method thereof

Publication Date: 2025.10.02 OLUM MATERIAL CORP

AI summary

Provided is a semiconductor test device. A semiconductor test device according to an embodiment is designed for testing an electrical connection of a semiconductor and includes a membrane portion comprising a first surface and a plurality of aperture patterns extending in a direction of a second surface opposite to the first surface, wherein the membrane portion comprises a metal thin film portion having the plurality of aperture patterns, and an insulating layer portion having an insulating material coated on a surface of the metal thin film portion, a contact protrusion portion is formed to protrude from the first surface of the metal thin film portion, neighboring aperture patterns are insulated from each other, and an electrical connection path is formed from the top to the bottom of each of the aperture patterns.