Aperture Switching Mechanism for Semiconductor Bonding
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Solution Overview
Problem
The challenge lies in balancing the optical resolution and depth of field in imaging apparatuses used for packaging thick semiconductor chips, where reducing the aperture improves resolution but decreases depth of field, hindering the packaging process of laminated devices.
Innovation Solution
Incorporating an aperture switching mechanism in the imaging apparatus that allows switching between a first and second aperture, enabling high-resolution imaging for precise offset adjustments and measurements while maintaining a larger depth of field for packaging processes by adjusting focal length accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the aperture of the optical system is decreased to increase depth of field for packaging laminated devices, then the depth of field is improved, but the optical resolution is reduced
Solution Approach 1:
The patent applies dynamics by making the aperture adjustable rather than fixed. The aperture can be dynamically changed between a first aperture (smaller diameter) for packaging processes requiring large depth of field, and a second aperture (larger diameter) for additional processes requiring high optical resolution. This dynamic adjustment allows the system to adapt to different operational requirements.
Solution Approach 2:
The patent changes the aperture parameter of the optical system based on the process being performed. By switching between different aperture diameters, the system optimizes the balance between depth of field and optical resolution for different tasks - using a smaller aperture for packaging and a larger aperture for inspection and measurement processes.
2Measurement precision
If the aperture of the optical system is increased to improve optical resolution for offset adjustment, then the optical resolution is improved, but the depth of field is reduced
Solution Approach 1:
The system dynamically adjusts the aperture size based on the specific task. For offset adjustment and inspection processes requiring high optical resolution, the aperture is switched to the second aperture (larger diameter). For packaging processes requiring large depth of field, it switches to the first aperture (smaller diameter).
Solution Approach 2:
The aperture parameter is changed according to the process requirements. The control unit switches between aperture configurations to optimize both optical resolution and depth of field for different operational phases, ensuring high precision in both packaging and additional processes.
3Device complexity
If a single aperture configuration is used in the optical system, then the device complexity is reduced, but the adaptability for different processes (packaging and additional processes) is limited
Solution Approach 1:
The optical system is designed with multi-functionality by incorporating an aperture switching mechanism that allows the same optical system to serve multiple purposes. The first aperture configuration is optimized for packaging processes, while the second aperture configuration is optimized for additional processes such as offset adjustment and inspection, making the system universally applicable to different operational requirements.
Solution Approach 2:
The aperture switching mechanism introduces dynamic adaptability to the optical system. The control unit can switch between different aperture configurations based on the process being performed, enabling the system to adapt to varying requirements for depth of field and optical resolution without requiring multiple separate optical systems.
Data Source
AI summary
A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.