Semiconductor/Solid-State Device Details TRIZ Cases

Aligned carbon fibers in a composite sheet lower thermal resistance below 0.17 K·cm2/W while maintaining flexibility for semiconductor devices.

Conductive ink printed traces on die surfaces and sidewalls enable direct electrical interconnections between stacked semiconductor components.

Spanking die aligns lead tips using protrusion and groove features to prevent deformation during processing.

Phase change materials reduce thermal resistance and prevent chip damage from vibration.

Through via-holes with high conductivity members reduce thermal resistance by dissipating heat vertically, suppressing transistor temperature rise.

Distinctive notch patterns on die pads guide optical alignment to reduce chip spacing while preventing resin void formation.

Passively controlled smart microjet cooling array uses bimetallic deflection structures to open nozzles for localized electronic component heat removal.

Concave portions in the graphite sheet contain thermal conductive fillers, preventing leakage during pressurization and reducing thermal resistance.

Encapsulant provides structural support during substrate thinning, eliminating temporary carriers and enabling higher processing temperatures.

Merging the housing and circuit carrier into a single injection-molded component reduces part count while maintaining tight manufacturing tolerances.

A multifunction semiconductor package structure embeds common mode filters and transient voltage suppressors within a single substrate unit.

A semiconductor wafer uses a protective film positioned beyond conductive patterns to guide ring cutting.

An embedded shielding layer inside the semiconductor substrate blocks electromagnetic interference without increasing package volume.

Zigzag terminal rows and a dummy bump suppress sagging in slim drive chips, securing circuitry area without enlarging the chip size.

A metal-semiconductor alloy interconnection structure enables lower resistivity in nanoscale dimensions.

An intermediary silicon carbide layer improves passivation adhesion to prevent stress-induced cracking during die separation.

Nested hanging die mounting reduces vertical profile while maintaining packing density, resolving space constraints in compact electronics.

Laminated Ni-P and Au layers on the mounting surface improve solder wettability, resolving poor attachment accuracy in Fan-Out packages.

Integrating a bridge circuit with an IC driver reduces device complexity while maintaining compact form factors for LCD backlight applications.

Aperture switching mechanism balances depth of field and resolution for semiconductor chip packaging.

Tape masking on the second substrate enables pad exposure during encapsulant molding, eliminating reflow contamination and special mold requirements.

Distinct rewiring structures connect chip selection pads to through silicon vias, enabling operational chip selection without increasing package height.

An aluminum alloy film containing nickel and nitrogen connects directly to a silicon semiconductor layer.

Wafer-bonded microlenses align optical signals with grating couplers, reducing assembly complexity in silicon photonic interposers.

Preheating metal paste removes organics to prevent voids during rapid sintering, enhancing semiconductor die bond reliability.

A semiconductor laser design employs a stepped plated metal layer to enhance thermal contact and suppress temperature increases at the light-emitting end face.

A dual damascene interconnection structure uses a protective liner layer to define via and trench openings for conductive placement.

Non-metal containers with phase-change materials store latent heat, preventing oxidation and corrosion while managing high heat density.

An etching stopping layer protects source metal during via hole formation, reducing damage and simplifying process control in gallium nitride devices.

Integrating IPDs over encapsulant reduces vertical space and adhesion issues during passivation, lowering manufacturing costs.

A double-sided semiconductor package uses symmetrically arranged power terminals to minimize parasitic inductances and switching losses.

Orthogonal tie bar placement on the semiconductor base prevents short circuits from conductive instruments while maintaining operational reliability.

Segmented conductive paths minimize signal delay for high-resolution displays.

A silicone resin film encapsulates semiconductor wafers with strong adhesion and minimal warpage during curing.

Opening in wiring pattern exposes base for bonding layer contact, preventing peeling under thermal stress.

Segmenting the die attach pad from the lead frame via a conductive wire ribbon reduces package footprint while maintaining connection strength.

A semiconductor package uses a heat emission member with horizontal and vertical units to conduct thermal energy away from lower chips.

A metal bonded nanotube array transfers heat via eutectic bonding, resolving thermal expansion mismatches that crack rigid solder joints.

Segmented front and back shielding layers absorb and reflect RF noise to protect baseband circuits while dissipating heat in compact semiconductor packages.

A semiconductor package structure integrates a heat sink frame with a lead frame to improve thermal management and electrical connectivity.

Integrated pin-short detection circuit within power converter IC packages monitors electrical conductivity between pins.

Turbulent structures on heat dissipation fins disrupt airflow boundary layers to enhance convection efficiency in compact projectors.

Side inlet injection and trace mark cutting resolve the contradiction between molding simplicity and surface quality.

Dual fans mounted on fixing frames create direct airflow paths across parallel memory modules, replacing ineffective natural convection.

A semiconductor interposer substrate design forming solder ball pads directly on a second wiring layer to streamline manufacturing.

A ground terminal directs surge voltage to a common ground, allowing standard semiconductor elements to replace expensive high-withstand components.

A wafer jig copies device wafer identification marks onto a circular plate for mechanism inspection.

A dual-die semiconductor package uses an interposing substrate to provide localized power and ground planes for the top device die.

Nested molding compounds on a padless lead frame reduce package height while maintaining hermetic environmental protection.