Semiconductor Lead Tip Alignment via Spanking Die Pressing
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Solution Overview
Problem
The manufacturing yield of semiconductor devices with leads is reduced due to deformation of tip portions during processing, leading to inconsistent pitch alignment with mounting holes on the wiring substrate, especially as lead lengths increase, causing unevenness and deformation that complicates alignment.
Innovation Solution
A spanking die with specific protrusion and groove configurations is used to align and press both tip and bent portions of the leads, dispersing processing strain and stabilizing the pitch between lead tip portions, ensuring alignment with mounting holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If lead length is increased to accommodate mounting requirements, then adaptability to different mounting configurations is improved, but manufacturing precision deteriorates due to deformation and unevenness of tip portions
Solution Approach 1:
The patent applies preliminary action by pressing and aligning the lead tip portions before the final mounting process. The leading portions of the leads are pressed by a pressing member to align them in advance, preventing deformation during subsequent mounting operations. This pre-alignment ensures that even with increased lead lengths, the pitch alignment precision is maintained when the leads are inserted into mounting holes.
2Ease of manufacture
If conventional lead processing methods are used, then ease of manufacture is maintained, but manufacturing precision deteriorates due to tip portion deformation
Solution Approach 1:
The patent applies segmentation by dividing the lead into distinct portions: the leading portion (tip) and the trailing portion. The pressing member specifically targets and presses only the leading portion to align it, while leaving the trailing portion unaffected. This segmented approach allows precise control over tip alignment without complicating the overall manufacturing process, maintaining ease of manufacture while improving lead shape precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the manufacturing yield of semiconductor devices by reducing unevenness and deformation, stabilizing the pitch between lead tip portions, and enhancing alignment accuracy, even with increased lead lengths.
Implementation Method 1
the tip portions of the deformed leads are aligned, not only the tip portions of the leads, but also the bent portions of the leads are pressed by a die
Data Source
AI summary
A manufacturing yield of a semiconductor device including a power transistor is improved. When forming a tip portion LE1c of a first lead, a tip portion LE2c of a second lead, and a tip portion LE3c of a third lead by using a spanking die SDM1, the tip portion LE1c of the first lead, the tip portion LE2c of the second lead, and the tip portion LE3c of the third lead are pressed by an upper surface of a protrusion portion provided on a pressing surface of a lower die SD1 and a bottom surface of a groove portion provided in a pressing surface of an upper die SU1, and a bent portion of the second lead and a bent portion of the third lead are pressed by a flat pressing surface of the lower die SD1 and a flat pressing surface of the upper die SU1.