Interposer Substrate Eliminating Second Conductive Pillars
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Solution Overview
Problem
Conventional interposer substrate manufacturing processes require additional steps and increased costs due to the need for second conductive pillars for solder ball pads, which complicates the integration of logic and memory packages in stacked semiconductor devices.
Innovation Solution
The interposer substrate design eliminates the need for second conductive pillars by forming a second wiring layer with solder ball pads directly on the second insulating layer, reducing the manufacturing steps and costs by allowing the carrier to be removed, and using a first insulating layer made of molding compounds or dielectric materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If second conductive pillars are formed for solder ball pads on the second insulating layer, then the interposer substrate can support memory packages with high density wiring, but the manufacturing steps and costs are undesirably increased
Solution Approach 1:
The patent removes the second conductive pillars from the structure entirely. Instead of forming additional conductive elements through the second insulating layer, the design uses the first conductive pillars that extend through both insulating layers to provide the necessary electrical connections for solder ball pads, thereby simplifying the manufacturing process while maintaining the capability to support high density wiring configurations
Solution Approach 2:
The first conductive pillars serve multiple functions: they provide electrical connections between the logic package and interposer substrate, extend through the second insulating layer to reach the solder ball pads on the second wiring layer, and eliminate the need for separate second conductive pillars. This multi-functional design reduces manufacturing complexity while maintaining all necessary electrical pathways
2Strength
If the carrier is completely removed to expose the first wiring layer, then the interposer substrate achieves proper structural integrity, but additional manufacturing steps are required
Solution Approach 1:
The first wiring layer is formed on the carrier before the insulating layers are applied. This preliminary formation allows the wiring pattern to be established early in the process, and the subsequent insulating layers and conductive pillars are built around this pre-formed wiring structure, simplifying the overall manufacturing sequence
Solution Approach 2:
The insulating layers serve as intermediaries that allow the carrier to be removed while maintaining structural integrity. The first insulating layer encapsulates the first conductive pillars and provides mechanical support, while the second insulating layer protects the second wiring layer. These insulating layers enable carrier removal without compromising the structural strength of the interposer substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and reduces costs by enabling the direct formation of solder ball pads on the second wiring layer, facilitating efficient integration of logic and memory packages in stacked semiconductor devices.
Implementation Method 1
a plurality of first conductive pillars 12 are electro-platted on the electrical connection pads 11 through the patterning process
Data Source
AI summary
A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming on the conductive pillars a second circuit layer that is electrically connected to the conductive pillars, forming a second insulating layer on the second surface of the first insulating layer and the second circuit layer, exposing a portion of a surface of the second circuit layer from the second insulating layer, and removing the carrier. The invention further provides the interposer substrate as described above.