Conductive Wire Ribbon Interconnects Die Attach Pad and Lead Frame
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Solution Overview
Problem
Existing semiconductor package fabrication methods require a large footprint due to the unitary connection between the die attach pad and lead frame, which limits the use of delicate components and restricts the interchangeability of these components, leading to increased production costs and inefficient use of space.
Innovation Solution
A semiconductor package that uses a conductive wire ribbon to form both mechanical and electrical connections between the die attach pad and the lead frame, allowing for interchangeable components and reducing the package footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a unitary lead frame and die attach pad configuration is used, then mechanical strength is improved, but package footprint increases
Solution Approach 1:
The lead frame and die attach pad are divided into separate components. The die attach pad is detached from the lead frame structure, allowing independent optimization of each component. This segmentation enables the lead frame to maintain its mechanical strength while the die attach pad can be positioned more efficiently to reduce overall package footprint.
2Strength
If high temperature tape or solder is used to attach the pad and frame, then mechanical connection strength is improved, but delicate components are thermally damaged
Solution Approach 1:
A low-temperature adhesive serves as an intermediary bonding agent between the die attach pad and lead frame. This adhesive provides sufficient mechanical connection strength while operating at temperatures that do not damage delicate components, replacing the need for high-temperature solder or tape attachment.
3Ease of manufacture
If the die attach pad is integrated with the lead frame, then manufacturing simplicity is improved, but interchangeability and adaptability are reduced
Solution Approach 1:
By segmenting the die attach pad from the lead frame into separate components, each can be manufactured independently using optimized processes. This enables interchangeability where different die attach pads can be paired with different lead frames, improving adaptability while maintaining manufacturing efficiency through modular assembly.
4Strength
If the die attach pad is stamped to create a downset, then mechanical connection is improved, but package footprint increases
Solution Approach 1:
The downset feature is extracted from the integrated lead frame structure and implemented as a separate characteristic of the detached die attach pad component. This allows the downset to provide mechanical connection benefits without constraining the overall package footprint, as the die attach pad can be positioned independently of the lead frame boundaries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the use of delicate components without thermal damage, reduces production costs by allowing independent revisions of die attach pads and lead frames, and minimizes the package footprint, enhancing efficiency and versatility in semiconductor package design.
Implementation Method 1
A semiconductor package that uses a conductive wire ribbon to form a mechanical and electrical connection between the die attach pad and the leads of the lead frame
Data Source
AI summary
Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.