Smart Microjet Cooling Array with Passive Thermal Control
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Solution Overview
Problem
Conventional impingement cooling systems for electronic components are inefficient due to timed activation methods that are not accurately related to actual temperature conditions and require complex sensors and control structures, leading to increased manufacturing, operation, and maintenance complexities.
Innovation Solution
A passively controlled smart microjet impingement cooling array using thermally conductive pins and shape memory alloys or bimetallic materials that deform to open and close nozzles in response to localized temperature changes, allowing for focused and efficient cooling without the need for sensors or electronic control mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If timed activation control is used to activate cooling jets, then cooling coverage can be provided, but cooling is not accurately related to actual temperature conditions leading to inefficiency
Solution Approach 1:
The cooling system uses temperature-sensitive materials (shape memory alloys, bimetallic strips) integrated into the nozzle structure itself to automatically open or close based on local temperature conditions. This self-service mechanism eliminates the need for external sensors and control systems, ensuring that cooling is precisely activated only when and where temperature thresholds are exceeded, thereby improving both cooling efficiency and temperature condition accuracy.
Solution Approach 2:
The patent replaces complex electronic control systems (sensors, controllers, actuators) with a passive thermal-mechanical system. The shape memory alloy or bimetallic strip directly couples thermal conditions to mechanical nozzle opening/closing action, substituting electronic control with a simpler thermal-mechanical response that is inherently more accurate to actual temperature conditions.
2Reliability
If active control with sensors and control electronics is used, then cooling can be precisely controlled according to temperature conditions, but device complexity and manufacturing, operation, and maintenance implications increase
Solution Approach 1:
The nozzle structure serves its own control function by incorporating temperature-sensitive materials that automatically respond to thermal conditions. The nozzle body or deflecting structure itself acts as the temperature sensor and actuator, eliminating the need for separate sensing and control components. This self-service approach maintains precise temperature-based control while dramatically reducing device complexity.
Solution Approach 2:
The patent merges the functions of temperature sensing, control decision-making, and actuation into a single integrated component - the temperature-sensitive nozzle structure. The shape memory alloy or bimetallic strip combines these three functions that would traditionally be separate (sensor, controller, actuator), thereby achieving precise temperature control with minimal device complexity.
3Ease of operation
If conventional cooling systems are used, then cooling can be provided, but manufacturing, operation, and maintenance complexities increase due to complex sensors and control structures
Solution Approach 1:
The patent employs inexpensive temperature-sensitive materials (shape memory alloys, bimetallic strips) that can be easily manufactured and integrated into the cooling system. These passive components are simpler and cheaper to manufacture than electronic sensors and control systems, and while they may have limited lifetimes, their simplicity makes replacement straightforward, overall improving ease of manufacture and operation.
Solution Approach 2:
The invention extracts and eliminates the complex electronic control subsystem (sensors, controllers, wiring, power supplies) from the cooling system, retaining only the essential cooling function with passive thermal-mechanical control. This extraction of unnecessary complexity simplifies both manufacturing and operation while maintaining effective cooling control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides effective, localized cooling that is spatially and thermally coupled with electronic components, reducing heat transfer and maintaining a cost-effective, customizable solution for various electronic components with different thermal loads and geometric layouts.
Implementation Method 1
The material forming the orifice or jet nozzle or at least one of their respective parts is made of a shape memory alloy or polymer, or of bimetallic material or two composite materials with different thermal expansion coefficients, which change their shape based on localized temperature changes.
Implementation Method 2
bimetallic material or two composite materials with different thermal expansion coefficients, which change their shape based on localized temperature changes
Implementation Method 3
A plurality of thermally conductive pins respectively are in thermal contact with the deflection structures of the plurality of nozzles that conduct heat from at least one of the electronic components to the deflection structures of the nozzles
Implementation Method 4
The jets 28 administer the cooling fluid to the surface of the chip to remove the heat generated by the chip
Implementation Method 5
combinations of jet impingement with other cooling techniques (such as evaporative or thermo-electric cooling using the Peltier effect) have been investigated to further enhance cooling efficiencies
Data Source
AI summary
An impingement cooling system for cooling electronic components includes a nozzle array having a plurality of nozzles in fluid communication with a source of cooling fluid, each nozzle including a deflection structure that deforms above a threshold temperature. A plurality of thermally conductive pins respectively are in thermal contact with the deflection structures and conduct heat from at least one of the electronic components to the deflection structures. When a heated nozzle within the nozzle array reaches a temperature above the threshold temperature due to heat conducted from the respective thermally conductive pin, the deflection structure of the heated nozzle deforms from a closed position to an open position to permit cooling fluid to impinge upon the electronic component. The deflection structure may be a deflection plate formed of a bimetallic material having layers of different thermal expansion coefficients, or a thermally responsive two-way shape memory material.