Embedded Shielding Layer for Semiconductor EMI Reduction
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Solution Overview
Problem
As semiconductor devices operate at higher speeds, they generate significant electromagnetic interference (EMI), which can degrade the reliability of electronic appliances and is not effectively addressed by existing shielding methods that increase package size and fail to solve interference between chips and substrates.
Innovation Solution
A semiconductor chip design featuring a shielding layer within the substrate, with through electrodes and dielectric layers to isolate and ground the shielding, and additional shielding on side surfaces or in grooves, to block electromagnetic waves without increasing package size, allowing for stacked configurations that prevent EMI between chips and the structural body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding layer is formed on the molding part of a semiconductor package, then electromagnetic wave blocking is improved, but the package size increases
Solution Approach 1:
The shielding layer is formed inside the semiconductor substrate, nesting the EMI prevention function within the existing package structure rather than adding external layers, thus preventing EMI without increasing package size
Solution Approach 2:
The shielding approach transitions from a two-dimensional surface layer on the molding part to a three-dimensional structure embedded within the substrate thickness, utilizing the vertical dimension to achieve EMI blocking without lateral expansion
2Object-generated harmful factors
If a shielding layer is formed on the molding part of a semiconductor package, then electromagnetic wave radiation is reduced, but EMI between semiconductor chips and between chip and substrate cannot be solved
Solution Approach 1:
The shielding structure is segmented into multiple functional layers including a first shielding layer, second shielding layer, and ground layer, with each segment performing specific EMI prevention functions to address both radiation and internal interference
Solution Approach 2:
A ground layer is introduced as an intermediary between the shielding layers and the semiconductor chip, acting as a mediator to prevent EMI coupling between the chip and substrate while maintaining shielding effectiveness
3Speed
If the operation speed of semiconductor device increases, then processing speed is improved, but electro-magnetic waves are generated causing EMI
Solution Approach 1:
The ground layer and shielding structure convert the harmful electromagnetic waves generated by high-speed operation into controlled current paths that are directed to ground, transforming EMI into a manageable electrical phenomenon
Solution Approach 2:
The shielding layers and ground structure are pre-configured to counteract electromagnetic interference before it can propagate, providing preliminary protection that enables high-speed operation without EMI consequences
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces electromagnetic interference, enabling a lightweight, compact, and miniaturized semiconductor package that improves the reliability of electronic appliances by blocking EMI between chips and the structural body, while maintaining a slim and compact form factor.
Implementation Method 1
a shielding layer formed in the semiconductor substrate to correspond to the other surface
Implementation Method 2
a dielectric layer electrically isolating the first through electrodes and the shielding layer from each other
Data Source
AI summary
A semiconductor chip includes a semiconductor substrate having one surface, the other surface which faces away from the one surface, and an integrated circuit which is formed on the one surface; and a shielding layershielding layer formed in the semiconductor substrate to correspond to the other surface.